Inventor

Jiann-Tyng Tzeng

Inventor

Hsinchu, TW

Overview

2003–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 89 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary

H10DInorganic electric semiconductor devices26%

H01LSemiconductor devices24%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%

G06FElectric digital data processing11%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%

H03KPulse technique2%

H10BElectronic memory devices2%

G02BOptical elements, systems or apparatus2%

G01RMeasuring electric variables1%

PatentTitleYear

11,133,255Metal patterning for internal cell routing2021 11,133,254Hybrid power rail structure2021 11,126,775IC layout, method, device, and system2021 11,121,256Semiconductor device integrating backside power grid and related integrated circuit and fabrication method2021 11,100,273Integrated circuit and method of manufacturing same2021 11,088,092Via rail solution for high power electromigration2021 11,080,454Integrated circuit, system, and method of forming the same2021 11,063,005Via rail solution for high power electromigration2021 11,055,469Power structure with power pick-up cell connecting to buried power rail2021 11,048,848Semiconductor device including region having both continuous regions, and method and system for generating layout diagram of same2021 11,043,426Dummy MOL removal for performance enhancement2021 11,024,580Random cut patterning2021 11,024,579Dual power structure with connection pins2021 11,018,157Local interconnect structure2021 10,977,417Semiconductor structure, device, and method2021 10,977,421System for and method of manufacturing an integrated circuit2021 10,971,493Integrated circuit device with high mobility and system of forming the integrated circuit2021 10,964,684Multiple fin height integrated circuit2021 10,950,456High-density semiconductor device2021 10,878,162Metal with buried power for increased IC device density2020 10,879,120Self aligned via and method for fabricating the same2020 10,878,161Method and structure to reduce cell width in integrated circuits2020 10,879,173Middle-end-of-line strap for standard cell2020 10,878,158Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of same2020 10,879,229Integrated circuit, system for and method of forming an integrated circuit2020 10,867,102Inverted pitch IC structure, layout method, and system2020 10,867,833Buried metal for FinFET device and method2020 10,868,008Double rule integrated circuit layouts for a dual transmission gate2020 10,867,115System and method for calculating cell edge leakage2020 10,867,917Semiconductor device, associated method and layout2020 10,861,790Power strap structure for high performance and low current density2020 10,847,460Advanced metal connection with metal cut2020 10,833,061Semiconductor device including source/drain contact having height below gate stack2020 10,804,402Metal rail conductors for non-planar semiconductor devices2020 10,797,078Hybrid fin field-effect transistor cell structures and related methods2020 10,784,168Dummy MOL removal for performance enhancement2020 10,784,869Integrated circuit and method of manufacturing the same2020 10,769,342Pin access hybrid cell height design2020 10,763,365Metal rail conductors for non-planar semiconductor devices2020 10,734,377Integrated circuit, system for and method of forming an integrated circuit2020 10,714,485Semiconductor device which includes Fins2020 10,700,207Semiconductor device integrating backside power grid and related integrated circuit and fabrication method2020 10,658,292Metal patterning for internal cell routing2020 10,565,348System for and method of fabricating an integrated circuit2020 10,522,542Double rule integrated circuit layouts for a dual transmission gate2019 10,516,047Structure and formation method of semiconductor device structure2019 10,510,688Via rail solution for high power electromigration2019 10,510,776Semiconductor device with common active area and method for manufacturing the same2019 10,503,863Integrated circuit and method of manufacturing same2019 10,468,349Advanced metal connection with metal cut2019 10,467,374System and method for calculating cell edge leakage2019 10,446,406High-density semiconductor device2019 10,366,200System for and method of manufacturing a layout design of an integrated circuit2019 10,297,588Semiconductor device and fabrication method of the same2019 10,276,499Dual power structure with connection pins2019 10,204,857Middle end-of-line strap for standard cell2019 10,177,133Semiconductor device including source/drain contact having height below gate stack2019 10,170,422Power strap structure for high performance and low current density2019 10,162,930Method of adjusting metal line pitch2018 10,157,922Interconnect metal layout for integrated circuit2018 10,109,582Advanced metal connection with metal cut2018 10,096,522Dummy MOL removal for performance enhancement2018 10,074,657Method of manufacturing fins and semiconductor device which includes fins2018 10,050,028Semiconductor device with reduced leakage current2018 10,032,759High-density semiconductor device2018 9,984,964Integrated circuit having slot via and method of forming the same2018 9,911,697'Power strap structure for high performance and low current density'2018 9,837,353Middle end-of-line strap for standard cell2017 9,793,211'Dual power structure with connection pins'2017 9,741,654'Integrated circuit having slot via and method of forming the same'2017 9,679,994'High fin cut fabrication process'2017 9,659,115'Thermal analysis for tiered semiconductor structure'2017 9,478,492'Integrated circuit having slot via and method of forming the same'2016 9,442,510'Clock circuit and method of operating the same'2016 9,385,213'Integrated circuits and manufacturing methods thereof'2016 9,184,250'Semiconductor arrangement and formation thereof'2015 8,698,205'Integrated circuit layout having mixed track standard cell'2014 8,443,306'Planar compatible FDSOI design architecture'2013 8,362,573'Integrated circuits and manufacturing methods thereof'2013 8,122,406'Generating models for integrated circuits with sensitivity-based minimum change to existing models'2012 7,605,413'High voltage devices'2009 7,151,296'High voltage lateral diffused MOSFET device'2006 7,095,544'Micromirror and products using the same'2006 6,998,304'Method for integrated manufacturing of split gate flash memory with high voltage MOSFETS'2006 6,958,249'Method to monitor process charging effect'2005 6,947,196'Trench-embedded mirror structure for double substrate spatial light modulator'2005 6,929,969'Reflective spatial light modulator mirror device manufacturing process and layout method'2005 6,841,081'Method for manufacturing reflective spatial light modulator mirror devices'2005 6,660,624'Method for reducing fluorine induced defects on a bonding pad surface'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG (15)· patent assignee history

2003–2005Based in Yilan County, TW· patent location history

2005–2021Based in Hsinchu, TW· patent location history

2005–2021Based in Hsin Chu, TW· patent location history

2006Based in Shiang Ilan, TW· patent location history

2012–2014Patents assigned to TZENG JIANN-TYNG (4)· patent assignee history

2012–2013Patents assigned to SCOTT DAVID B (2)· patent assignee history

2013Patents assigned to GUO TA-PEN (2)· patent assignee history

2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (74)· patent assignee history

2020Based in Tu-Chun, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	74	2016–2021
TAIWAN SEMICONDUCTOR MFG	15	2003–2020
TZENG JIANN-TYNGself	4	2012–2014
GUO TA-PEN	2	2013
SCOTT DAVID B	2	2012–2013

Locations

Location	Patents	Span
Hsinchu, TW	62	2005–2021
Hsin Chu, TW	22	2005–2021
Yilan County, TW	2	2003–2005
Tu-Chun, TW	1	2020
Shiang Ilan, TW	1	2006