Inventor
Yoshinao Miyata
Inventor
Nagano, JP
Overview
Patents· 76 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B41Jprimary
B41JTypewriters72%
Y10TTechnical subjects covered by former us classification12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general1%
B23KSoldering or unsoldering1%
B28DWorking stone or stone-like materials1%
G01SRadio direction-finding1%
H01LSemiconductor devices1%
PatentTitleYear
10,639,898Liquid ejecting apparatus202010,464,321Liquid ejecting head and liquid ejecting apparatus201910,195,858Liquid ejecting apparatus201910,065,424Liquid ejecting head and liquid ejecting apparatus20189,873,249Liquid ejecting head and liquid ejecting apparatus20189,827,773Liquid supply unit having an engagement structure for engaging a liquid engagement device20179,821,342'Ultrasonic sensor and method for producing the same'20179,676,185'Liquid ejecting head and liquid ejecting apparatus'20179,610,770'Liquid ejecting head and liquid ejecting apparatus'20179,566,794'Liquid supply unit having an inclined structure for mounting an electrical contact'20179,533,505'Liquid ejecting apparatus'20179,434,162'Liquid ejecting head and liquid ejecting apparatus'20169,365,041'Liquid ejecting head and liquid ejecting apparatus'20169,346,266'Liquid ejecting head and liquid ejecting apparatus'20169,308,724'Liquid ejecting head and liquid ejecting apparatus'20169,233,546'Liquid supply unit'20169,174,444'Liquid ejecting head and liquid ejecting apparatus'20159,144,980'Liquid ejecting apparatus'20159,050,804'Liquid ejecting head and liquid ejecting apparatus'20158,944,565'Liquid ejecting head and liquid ejecting apparatus'20158,833,911'Liquid ejecting head and liquid ejecting apparatus'20148,757,782'Liquid ejecting head and liquid ejecting apparatus'20148,596,767'Liquid ejecting head and liquid ejecting apparatus'20138,573,746'Liquid ejection head wiring member and liquid ejection head'20138,393,717'Liquid ejecting head and method of inspecting liquid ejecting head'20138,371,679'Liquid ejecting head unit and liquid ejecting apparatus'20138,348,394'Liquid ejecting head'20138,313,175'Liquid ejecting head'20128,313,172'Liquid ejection head wiring member and liquid ejection head'20128,162,448'Liquid ejection head and manufacturing method thereof'20128,141,985'Liquid ejecting head, liquid ejecting apparatus, and method for manufacturing liquid ejecting head'20128,075,106'Liquid ejecting head and liquid ejecting apparatus'20117,891,782'Liquid injecting head, method of manufacturing liquid injecting head, and liquid injecting device'20117,841,085'Method for manufacturing liquid jet head'20107,829,446'Method for dividing wafer, method for manufacturing silicon devices, and method for manufacturing liquid ejecting heads'20107,659,128'Method of processing silicon wafer and method of manufacturing liquid ejecting head'20107,585,046'Liquid-jet head unit and liquid-jet apparatus'20097,553,003'Liquid-jet head and liquid-jet apparatus'20097,537,313'Liquid-jet head and liquid-jet apparatus'20097,399,061'Bonding structure, actuator device and liquid-jet head'20087,239,070'Liquid-jet head and liquid-jet apparatus'20077,153,442'Method of manufacturing an ink jet print head'20067,152,963'Liquid jet head and liquid jet apparatus'20066,966,635'Ink jet recording head and ink jet recording apparatus comprising the same'20056,959,490'Method of manufacturing silicon device, method of manufacturing liquid jet head and liquid jet head'20056,886,923'Small-sized liquid-jet head and liquid-jet apparatus with increased number of arrays of nozzle orifices'20056,878,609'Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break pattern'20056,869,170'Ink-jet recording head having a vibration plate prevented from being damaged and ink-jet recording apparatus for using the same'20056,840,601'Liquid-jet head and liquid-jet apparatus'20056,820,969'Liquid-jet head and liquid-jet apparatus'20046,796,640'Liquid-jet head and liquid-jet apparatus'20046,789,319'Method of manufacturing an ink jet print head'20046,764,167'Ink-jet recording head inkjet recording apparatus'20046,699,552'Silicon wafer break pattern, silicon substrate'20046,616,270'Ink jet recording head and ink jet recording apparatus comprising the same'20036,533,402'Ink-jet recording head, method of manufacturing the same, and ink-jet recording apparatus'20036,502,928'Ink jet recording head and ink jet recording apparatus comprising the same'20036,502,930'Ink jet recording head, method for manufacturing the same, and ink jet recorder'20036,382,781'Micro device, ink-jet printing head, method of manufacturing them and ink-jet recording device'20026,378,996'Ink-jet recording head and ink-jet recording apparatus'20026,336,717'Ink jet recording head and ink jet recording apparatus'20026,315,400'Ink jet recording head and ink jet recorder'20016,290,341'Ink jet printing head which prevents the stagnation of ink in the vicinity of the nozzle orifices'20016,250,753'Ink-jet recording head'20016,238,585'Method for manufacturing an ink-jet head having nozzle openings with a constant width'20016,209,994'Micro device, ink-jet printing head, method of manufacturing them and ink-jet recording device'20016,193,360'Ink-jet recording head'20016,137,511'Ink jet recording head having an ink reservoir comprising a plurality of grooves with increased strength and volume capacity and ink jet recording apparatus having the same'20006,113,225'Ink jet type recording head'20006,109,736'Ink jet recording head containing a sealed fluid for protecting a piezoelectric vibrator'20006,109,738'Ink jet print head and a method of manufacturing the same'20005,992,974'Ink-jet head having nozzle openings with a constant width and manufacturing method thereof'19995,984,459'Ink-jet printing head and ink-jet printing apparatus using same'19995,922,218'Method of producing ink jet recording head'19995,754,205'Ink jet recording head with pressure chambers arranged along a 112 lattice orientation in a single-crystal silicon substrate'19985,231,420'Thermal print head'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2020Patents assigned to SEIKO EPSON CORP (76)· patent assignee history
1993–2019Based in Nagano, JP· patent location history
2010–2020Based in Matsukawa-mura, JP· patent location history
2011–2015Patents assigned to MIYATA YOSHINAO (11)· patent assignee history
2011–2013Patents assigned to GOTO KAZUTOSHI (2)· patent assignee history
2012–2015Patents assigned to FUKUZAWA YUMA (2)· patent assignee history
2012–2015Patents assigned to GAO YUE (2)· patent assignee history
2012–2016Based in Suwa, JP· patent location history
2015–2016Based in Suntou-gun, JP· patent location history
2018Based in Matsumoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEIKO EPSON CORP | 76 | 1993–2020 |
| MIYATA YOSHINAOself | 11 | 2011–2015 |
| FUKUZAWA YUMA | 2 | 2012–2015 |
| GAO YUE | 2 | 2012–2015 |
| GOTO KAZUTOSHI | 2 | 2011–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagano, JP | 51 | 1993–2019 |
| Matsukawa-mura, JP | 18 | 2010–2020 |
| Suwa, JP | 3 | 2012–2016 |
| Suntou-gun, JP | 2 | 2015–2016 |
| Matsumoto, JP | 1 | 2018 |