Inventor
Charles L. Standley
Inventor
Wappingers Falls, NY, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
C03CChemical composition of glasses, glazes or vitreous enamels7%
H05KPrinted circuits7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
4,944,836'Chem-mech polishing method for producing coplanar metal/insulator films on a substrate'19904,789,648'Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias'19884,601,939'Composite insulator structure'19864,447,824'Planar multi-level metal process with built-in etch stop'19844,439,270'Process for the controlled etching of tapered vias in borosilicate glass dielectrics'19844,367,119'Planar multi-level metal process with built-in etch stop'1983Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1983–1990Patents assigned to IBM (6)· patent assignee history
1983–1990Based in Wappingers Falls, NY, US· patent location history
1984Based in Hopewell Junction, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 6 | 1983–1990 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 5 | 1983–1990 |
| Hopewell Junction, New York, US | 1 | 1984 |