Inventor
CHIA-YU WEI
Inventor
TW
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation35%
H10DInorganic electric semiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H04NPictorial communication, e.g. television4%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
12,501,190Multi-wafer stacked CMOS image sensor structure202512,470,845High dynamic-range (HDR) pixel circuit, color-image sensor package structure, and method for operating HDR pixel circuit202512,457,816Wide channel semiconductor device202512,453,192Single-photon avalanche diode semiconductor device202512,419,088Semiconductor structure and method of manufacturing the same202512,288,798Backside illuminated image sensor device with shielding layer and forming method202512,218,173Image sensor device202512,191,327CMOS image sensor having indented photodiode structure202512,009,323Semiconductor structure202411,855,118Image sensor device202311,843,007CMOS image sensor having indented photodiode structure202311,817,472Anchor structures and methods for uniform wafer planarization and bonding202311,810,939Method of forming backside illuminated image sensor device with shielding layer202311,784,198Wide channel semiconductor device202311,532,662Method of forming image sensor device202211,456,263Semiconductor structure and method for forming the same202211,380,721Wide channel gate structure202211,335,721Backside illuminated image sensor device with shielding layer202211,189,743Single photon avalanche diode202111,183,523CMOS image sensor having indented photodiode structure202111,152,417Anchor structures and methods for uniform wafer planarization and bonding2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (21)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 21 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 21 | 2021–2025 |