Inventor
Shoji Ikuhara
Inventor
Hikari, JP
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1035%
H01JElectric discharge tubes or discharge lamps18%
G05BControl or regulating systems in general15%
Y02PClimate change mitigation technologies in the production or processing of goods13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
H05HPlasma technique3%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
G01BMeasuring length, thickness or similar linear dimensions1%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light1%
H01LSemiconductor devices1%
PatentTitleYear
10,262,840Plasma processing apparatus20199,230,782'Plasma processing method and apparatus'20168,992,721'Plasma processing apparatus'20158,900,401'Plasma processing method and apparatus'20148,282,849'Etching process state judgment method and system therefor'20128,083,960'Etching endpoint determination method'20118,038,896'Plasma processing method and apparatus'20117,601,240'Disturbance-free, recipe-controlled plasma processing system and method'20097,376,479'Process monitoring device for sample processing apparatus and control method of sample processing apparatus'20087,343,217'System for monitoring and controlling a semiconductor manufacturing apparatus using prediction model equation'20087,330,346'Etching apparatus, method for measuring self-bias voltage, and method for monitoring etching apparatus'20087,158,848'Process monitoring device for sample processing apparatus and control method of sample processing apparatus'20077,107,115'Method for controlling semiconductor processing apparatus'20067,062,347'Maintenance method and system for plasma processing apparatus'20067,058,467'Process monitoring device for sample processing apparatus and control method of sample processing apparatus'20067,058,470'Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor'20067,010,374'Method for controlling semiconductor processing apparatus'20066,941,185'Operating method of vacuum processing system and vacuum processing system'20056,939,435'Plasma processing apparatus and processing method'20056,939,433'Sample processing apparatus and sample processing system'20056,908,529'Plasma processing apparatus and method'20056,885,906'Operating method of vacuum processing system and vacuum processing system'20056,881,352'Disturbance-free, recipe-controlled plasma processing method'20056,879,867'Process monitoring device for sample processing apparatus and control method of sample processing apparatus'20056,853,872'Operating method of vacuum processing system and vacuum processing system'20056,841,032'Plasma processing apparatus for adjusting plasma processing through detecting plasma processing state within chamber'20056,828,165'Semiconductor plasma processing apparatus with first and second processing state monitoring units'20046,776,872'Data processing apparatus for semiconductor processing apparatus'20046,745,096'Maintenance method and system for plasma processing apparatus etching and apparatus'20046,733,618'Disturbance-free, recipe-controlled plasma processing system and method'20046,714,832'Operating method of vacuum processing system and vacuum processing system'20046,706,543'Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a therefor'20046,616,759'Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor'20036,596,551'Etching end point judging method, etching end point judging device, and insulating film etching method using these methods'20036,069,096'Operating method of vacuum processing system and vacuum processing system'20004,936,967'Method of detecting an end point of plasma treatment'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2009Patents assigned to HITACHI LTD (22)· patent assignee history
1990Based in Kudamatsu, JP· patent location history
2000–2019Based in Hikari, JP· patent location history
2004–2019Patents assigned to HITACHI HIGH TECH CORP (15)· patent assignee history
2011–2015Patents assigned to IKUHARA SHOJI (4)· patent assignee history
2011–2015Patents assigned to KAGOSHIMA AKIRA (3)· patent assignee history
2011–2015Patents assigned to SHIRAISHI DAISUKE (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 22 | 1990–2009 |
| HITACHI HIGH TECH CORP | 15 | 2004–2019 |
| IKUHARA SHOJIself | 4 | 2011–2015 |
| KAGOSHIMA AKIRA | 3 | 2011–2015 |
| SHIRAISHI DAISUKE | 3 | 2011–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hikari, JP | 35 | 2000–2019 |
| Kudamatsu, JP | 1 | 1990 |