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Inventor

Chris Huskamp

Inventor
St. Louis, MO, US

Overview

2→
Patents
2009–2012
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary
B22FWorking metallic powder20%
B28BShaping clay or other ceramic compositions20%
B29CShaping or joining of plastics20%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering20%
Y02PClimate change mitigation technologies in the production or processing of goods20%
PatentTitleYear
8,104,799'Direct-manufactured duct interconnects'20127,623,940'Direct-manufactured duct interconnects'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2012Patents assigned to BOEING CO (2)· patent assignee history
2009–2012Based in St. Louis, MO, US· patent location history
2012Patents assigned to BAGWILL TRACY L (1)· patent assignee history
2012Patents assigned to HUSKAMP CHRIS (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
BOEING CO22009–2012
BAGWILL TRACY L12012
HUSKAMP CHRISself12012
Locations
LocationPatentsSpan
St. Louis, MO, US22009–2012