Inventor
Stephen W. Montgomery
Inventor
Federal Way, WA, US
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
G06FElectric digital data processing16%
B82YSpecific uses or applications of nanostructures11%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%
H10KOrganic electric solid-state devices5%
G11CStatic stores3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
7,770,630'Modular capillary pumped loop cooling system'20107,704,462'Method and apparatus for producing aligned carbon nanotube thermal interface structure'20107,269,008'Cooling apparatus and method'20077,269,481'Method and apparatus for memory bandwidth thermal budgetting'20077,115,987'Integrated stacked microchannel heat exchanger and heat spreader'20066,981,543'Modular capillary pumped loop cooling system'20066,965,513'Carbon nanotube thermal interface structures'20056,921,462'Method and apparatus for producing aligned carbon nanotube thermal interface structure'20056,891,724'Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD'20056,836,407'Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure'20046,776,221'Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component'20046,700,785'Computer system which locks a server unit subassembly in a selected position in a support frame'20046,693,797'Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2010Patents assigned to INTEL CORP (13)· patent assignee history
2004–2010Based in Federal Way, WA, US· patent location history
2006–2007Based in Seattle, WA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 13 | 2004–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Federal Way, Washington, US | 11 | 2004–2010 |
| Seattle, Washington, US | 2 | 2006–2007 |