Inventor
Eiji Hayashi
Inventor
Tokyo, JP
Overview
Patents· 93 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H05KPrinted circuits9%
H01LSemiconductor devices7%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
Y10TTechnical subjects covered by former us classification5%
C07DHeterocyclic compounds4%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
G01RMeasuring electric variables3%
G06FElectric digital data processing3%
PatentTitleYear
11,121,020Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board202110,872,857Three-dimensional memory device containing through-array contact via structures between dielectric barrier walls and methods of making the same202010,810,295Unified authentication management system202010,788,880Smartphone-based radar system for determining user intention in a lower-power mode202010,761,611Radar-image shaper for radar-based applications202010,725,161Seamless authentication using radar202010,714,415Semiconductor device and method of manufacturing the same202010,373,889Electronic device and method of manufacturing the same201910,283,444Semiconductor device and method of manufacturing the same201910,236,230Electronic device and method for manufacturing the same201910,202,140Pin assembly and steering device201910,147,671Semiconductor device and method for manufacturing same201810,096,654Three-dimensional resistive random access memory containing self-aligned memory elements20189,868,629'Semiconductor device'20189,831,166Semiconductor device20179,759,779'State of charge estimation device and method of estimating state of charge'20179,666,799'Concave word line and convex interlayer dielectric for protecting a read/write layer'20179,620,712'Concave word line and convex interlayer dielectric for protecting a read/write layer'20179,576,890'Semiconductor device and method of manufacturing the same'20179,523,711'Probe apparatus and wafer mounting table for probe apparatus'20169,517,532'Metal member, metal member surface processing method, semiconductor device, semiconductor device manufacturing method, and composite molded body'20169,496,153'Semiconductor device and method of manufacturing the same'20169,482,722'State of charge estimation device and method of estimating state of charge'20169,449,854'Semiconductor device and method of manufacturing the same'20169,299,681'Semiconductor device and method of manufacturing'20168,928,147'Semiconductor device and method of manufacturing the same'20158,822,269'Semiconductor device and method of manufacturing the same'20148,732,822'Device locking with hierarchical activity preservation'20148,581,410'Semiconductor device and method of manufacturing the same'20138,575,757'Semiconductor device and method of manufacturing the same'20138,496,849'Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal display device'20138,461,688'Semiconductor device and method of manufacturing the same'20138,399,068'Liquid crystal aligning agent, method of producing a liquid crystal alignment film and liquid crystal display device'20138,359,539'Image processing apparatus, information processing method, and computer-readable memory medium storing program therein'20138,314,495'Semiconductor device and method of manufacturing the same'20128,216,649'Liquid crystal aligning agent, method of producing a liquid crystal alignment film and liquid crystal display device'20128,101,514'Semiconductor device having elastic solder bump to prevent disconnection'20128,018,066'Semiconductor device and method of manufacturing the same'20117,951,701'Semiconductor device having elastic solder bump to prevent disconnection'20117,838,335'Manufacturing method of semiconductor device with a mold resin having a mold release agent'20107,791,204'Semiconductor device and method of manufacturing the same'20107,759,793'Semiconductor device having elastic solder bump to prevent disconnection'20107,619,765'Client server system, information processing apparatus and control method therefor, and program for executing the control method'20097,521,799'Semiconductor device and method of manufacturing the same'20097,481,305'Lock-up mechanism for torque converter'20097,459,342'Manufacturing method of semiconductor device'20087,437,831'Linear guide apparatus'20087,363,835'Ball screw apparatus'20087,298,521'Information processing apparatus, information processing method, recording medium, and program'20077,297,360'Insulation film'20077,194,329'Numerical control apparatus and numerical control system'20077,189,651'Stopper for chemical mechanical planarization, method for manufacturing same, and chemical mechanical planarization method'20077,185,553'Screw feed apparatus'20077,161,696'Information processing apparatus, print time informing method, and computer-readable memory medium storing program therein'20077,128,976'Composition for film formation, method of film formation, and silica-based film'20067,108,435'Printing control apparatus and method, and printing system'20066,912,428'System for developing an application system and implementing thereof'20056,861,814'Control parameter automatic adjustment apparatus'20056,830,390'Printing control apparatus and method, and printing system'20046,818,800'Methods for providing low-molecular radicals, radical-carrying molecules, a polymerization catalyst containing them and processes for polymerization and polymers produced thereby'20046,800,330'Composition for film formation, method of film formation, and silica-based film'20046,787,193'Method for the formation of silica film, silica film, insulating film, and semiconductor device'20046,639,376'Frequency characteristic identifying method and drive controlling apparatus'20036,558,747'Method of forming insulating film and process for producing semiconductor device'20036,503,633'Composition for film formation, process for producing composition for film formation, method of film formation, and silica-based film'20036,501,561'Overlay printing'20026,495,264'Composition for film formation, method of film formation, and silica-based film'20026,472,079'Composition for film formation, method of film formation, and silica-based film'20026,413,647'Composition for film formation, method of film formation, and silica-based film'20026,410,150'Composition for film formation, method of film formation, and insulating film'20026,410,151'Composition for film formation, method of film formation, and insulating film'20026,406,794'Film-forming composition'20026,406,199'Printing control apparatus and method'20026,265,244'Method for mounting semiconductor elements'20015,828,225'Semiconductor wafer probing apparatus'19985,769,618'Uniaxial eccentric screw pump having a flexible plastic shaft'19985,609,787'Method for extinguishing fire'19975,486,275'Nitrogen-containing perfluoroalkyl bromide and method for production thereof'19965,476,934'Nitrogen-containing perfluoroalkanoyl peroxide and method for production thereof'19955,380,844'Nitrogen-containing perfluoroalkanoyl peroxide and method for production thereof'19955,347,002'Nitrogen-containing perfluoroalkanoyl peroxide and method for production thereof'19945,256,825'Nitrogen-containing perfluoralkanoyl peroxide and method for production thereof'19935,208,339'Nitrogen-containing perfluoroalkanoyl peroxide and method for production thereof'19935,117,055'Method for direct conversion of fluorocarbonyl group into halogenides'19924,985,556'Perfluoro(dialkylaminopropene) derivatives'19914,751,308'Perfluorobicyclolactam compound and method for production thereof'19884,690,638'Water cooled scrap preheating bucket'19874,652,810'Subminiature current transformer'19874,620,157'Reactive power to DC signal converter'19864,469,879'Trichloropolyfluoro-bicyclo ethers'19844,336,494'Insulation resistance tester'19824,156,276'Effective value converting circuit'19794,145,652'Electric power to DC signal converter'1979Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1979–2020Based in Tokyo, JP· patent location history
1984–1997Patents assigned to AGENCY IND SCIENCE TECHN (11)· patent assignee history
1984–1996Patents assigned to MITI MINI INT TRADE & IND (8)· patent assignee history
1988–1997Based in Konan, JP· patent location history
2002–2013Patents assigned to JSR CORP (16)· patent assignee history
2002–2013Patents assigned to CANON KK (8)· patent assignee history
2002–2004Based in Ibaraki, JP· patent location history
2002–2021Based in Kawasaki, JP· patent location history
2010–2020Patents assigned to RENESAS ELECTRONICS CORP (15)· patent assignee history
2016–2019Based in Kariya, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JSR CORP | 16 | 2002–2013 |
| RENESAS ELECTRONICS CORP | 15 | 2010–2020 |
| AGENCY IND SCIENCE TECHN | 11 | 1984–1997 |
| CANON KK | 8 | 2002–2013 |
| MITI MINI INT TRADE & IND | 8 | 1984–1996 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 35 | 1979–2020 |
| Konan, JP | 10 | 1988–1997 |
| Ibaraki, JP | 9 | 2002–2004 |
| Kawasaki, JP | 5 | 2002–2021 |
| Kariya, JP | 5 | 2016–2019 |