Inventor
CHOON KUAN LEE
Inventor
SG
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
12,315,769Build-up package for integrated circuit devices, and methods of making same202511,367,667Build-up package for integrated circuit devices, and methods of making same202211,239,128Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices202211,189,548Pre-encapsulated lead frames for microelectronic device packages, and associated methods2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to MICRON TECHNOLOGY INC (4)· patent assignee history
2021–2025Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 4 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 4 | 2021–2025 |