Inventor

Toshikazu Narahara

Inventor

Ibaraki, JP

Overview

1976–1995

Patent span

Chemistry

Primary field (CPC C)

Patents· 42 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds17%

Y10TTechnical subjects covered by former us classification13%

H05KPrinted circuits11%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%

C08LCompositions of macromolecular compounds9%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds8%

C08JWorking-up6%

G11BInformation storage based on relative movement between record carrier and transducer4%

H01BCables4%

H02KDynamo-electric machines2%

PatentTitleYear

RE034885'Liquid crystal polyimide alignment free of scattering domains'1995 5,223,342'Magnetic recording medium having a lubricating layer comprising a binder and specified perfluoro polyoxyalkyl lubricant'1993 5,223,594'Flame-retardant resin composition containing a bromostyrene prepolymer'1993 5,212,244'Thermosetting resin composition, and prepreg and laminated sheet which use the same'1993 5,166,283'Polymer having dihydropyridine rings or dihydrotriazine rings, process for producing the same, and applications thereof'1992 5,128,435'Magnetic recording medium based on epoxy resins modified by isocyanates with poly(perfluoroether) backbones'1992 5,080,965'Prepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and maleimide'1992 5,071,715'Magnetic recording medium with a lubricant layer containing a perfluoro polyoxyalkyl compound'1991 5,041,478'Resin composition for printed circuit board'1991 5,028,513'Process for producing printed circuit board'1991 5,021,296'Circuit board and process for producing the same'1991 4,978,596'Electrophotographic toner comprising lactone-modified epoxy resin'1990 4,946,734'Resin composition for printed circuit board and such board formed by use thereof'1990 4,933,228'Thermosetting resin and prepreg and laminate using the same'1990 4,931,507'Composition comprising poly(p-hydroxystrene) derivative, epoxy-modified polybutadiene and aromatic maleimide'1990 4,900,807'Polymer from nitrile terminated compounds having Schiff bonds and process for preparing the same'1990 4,886,858'Thermosetting resin and prepreg and laminate using the same'1989 4,828,924'Magnetic recording medium'1989 4,784,917'Thermosetting resin composition and laminate and process for the production thereof'1988 4,781,439'Liquid crystal polyimide alignment free of scattering domains'1988 4,738,900'Thermo-setting, polymerizable composition and wiring board'1988 4,690,858'Thermal transfer sheet'1987 4,661,417'Composite of metal and resin having electrolytically reduced metal layer and process for producing the same'1987 4,612,127'Lubricant for metal forming and process for metal forming'1986 4,607,094'Thermosetting resin composition from aromatic cyanamide'1986 4,587,162'Resin composition and laminate produced therefrom comprising a cyclized polybutadiene and a prepolymer of a isocyanuric or cyanuric acid derivative'1986 4,393,177'Thermosetting resin composition, process for preparation thereof and cured product thereof'1983 4,369,288'Odorless or low-odor crosslinkable compound and resin composition containing the same'1983 4,366,516'Precision machinery component'1982 4,352,897'Resin molded stators'1982 4,304,818'Insulation system for winding of electric rotating machines and process of production thereof'1981 4,297,471'Odorless or low-odor crosslinkable compound and resin composition containing the same'1981 4,269,894'Electric windings and production thereof characterized by the use of a condensation type silicon resin for combination with an addition type silicon resin'1981 4,222,802'Process for producing electric windings'1980 4,129,554'Thermosettable, polymerizable resin composition comprising a polyepoxide and a polyisocyanate stabilized by incorporating an organic electron acceptor'1978 4,128,531'Thermosetting resin composition'1978 4,105,599'Process for producing rigid polyurethane foam'1978 4,100,114'Polyurethane foam composition'1978 4,070,416'Novel thermosetting resin and a process for producing same'1978 4,026,872'Epoxy resin compositions'1977 3,984,376'Thermosetting resin compositions prepared from isocyanates and epoxyphenols'1976 3,979,365'Process for producing thermosetting resins'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–1995Patents assigned to HITACHI LTD (37)· patent assignee history

1976–1981Based in Hitachi, JP· patent location history

1977–1993Based in Ibaraki, JP· patent location history

1978–1991Patents assigned to HITACHI CHEMICAL CO LTD (5)· patent assignee history

1978–1993Based in Tokai, JP· patent location history

1978–1991Based in Naka, JP· patent location history

1986–1995Based in Toukai, JP· patent location history

1987Patents assigned to NITTO ELECTRIC IND CO (1)· patent assignee history

1989Patents assigned to HITACHI MAXELL (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	37	1976–1995
HITACHI CHEMICAL CO LTD	5	1978–1991
HITACHI MAXELL	1	1989
NITTO ELECTRIC IND CO	1	1987

Locations

Location	Patents	Span
Ibaraki, JP	23	1977–1993
Tokai, JP	6	1978–1993
Hitachi, JP	6	1976–1981
Naka, JP	4	1978–1991
Toukai, JP	2	1986–1995