Inventor
Hai Shan Wu
Inventor
Beijing, CN
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing27%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form18%
C09JAdhesives9%
G01BMeasuring length, thickness or similar linear dimensions9%
G01NInvestigating or analysing materials by determining their chemical or physical properties9%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices9%
G06NComputing arrangements based on specific computational models9%
H05KPrinted circuits9%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2016Patents assigned to APPLE INC (2)· patent assignee history
2015Patents assigned to GRESPAN SILVIO (1)· patent assignee history
2015Patents assigned to HSU SHIH-MIN (1)· patent assignee history
2015Patents assigned to SUNG KUO-HUA (1)· patent assignee history
2015Based in Cupertino, CA, US· patent location history
2016Based in Kaohsiung, TW· patent location history
2021Patents assigned to IBM (2)· patent assignee history
2021Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLE INC | 2 | 2015–2016 |
| IBM | 2 | 2021 |
| GRESPAN SILVIO | 1 | 2015 |
| HSU SHIH-MIN | 1 | 2015 |
| SUNG KUO-HUA | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beijing, CN | 2 | 2021 |
| Kaohsiung, TW | 1 | 2016 |
| Cupertino, California, US | 1 | 2015 |