Inventor

Steven K. Groothuis

Inventor

Boise, ID, US

Overview

1996–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%

H01LSemiconductor devices37%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact6%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

G06FElectric digital data processing2%

G06TImage data processing or generation, in general2%

G11CStatic stores2%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%

PatentTitleYear

10,978,427Stacked semiconductor die assemblies with partitioned logic and associated systems and methods2021 10,816,275Semiconductor device assembly with vapor chamber2020 10,741,468Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods2020 10,679,921Semiconductor device packages with direct electrical connections and related methods2020 10,551,129Semiconductor device assembly with vapor chamber2020 10,215,500Semiconductor device assembly with vapor chamber2019 10,170,389Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods2019 10,163,755Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths2018 10,134,655Semiconductor device packages with direct electrical connections and related methods2018 9,899,293'Semiconductor device packages with improved thermal management and related methods'2018 9,837,396Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods2017 9,818,625'Stacked semiconductor die assemblies with thermal spacers and associated systems and methods'2017 9,780,079'Semiconductor die assembly and methods of forming thermal paths'2017 9,691,746'Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths'2017 9,543,274'Semiconductor device packages with improved thermal management and related methods'2017 9,443,744'Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods'2016 9,287,240'Stacked semiconductor die assemblies with thermal spacers and associated systems and methods'2016 9,184,105'Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages'2015 9,153,520'Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods'2015 8,816,494'Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages'2014 7,601,562'Microelectronic component assemblies having lead frames adapted to reduce package bow'2009 7,183,485'Microelectronic component assemblies having lead frames adapted to reduce package bow'2007 6,192,709'Quencher clamping operation using an electromagnet'2001 5,950,069'Quencher clamping operation using an electromagnet'1999 5,581,489'Model generator for constructing and method of generating a model of an object for finite element analysis'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–2001Patents assigned to TEXAS INSTRUMENTS INC (3)· patent assignee history

1996–2009Based in Rowlett, TX, US· patent location history

2007–2021Patents assigned to MICRON TECHNOLOGY INC (22)· patent assignee history

2014–2015Patents assigned to LI JIAN (2)· patent assignee history

2014–2015Patents assigned to LUO SHIJIAN (2)· patent assignee history

2014–2021Based in Boise, ID, US· patent location history

2015Patents assigned to ENGLAND LUKE G (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MICRON TECHNOLOGY INC	22	2007–2021
TEXAS INSTRUMENTS INC	3	1996–2001
LI JIAN	2	2014–2015
LUO SHIJIAN	2	2014–2015
ENGLAND LUKE G	1	2015

Locations

Location	Patents	Span
Boise, ID, US	20	2014–2021
Rowlett, Texas, US	5	1996–2009