Inventor
DongSam Park
Inventor
Ichon-si, KR
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1064%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H01LSemiconductor devices12%
H05KPrinted circuits4%
PatentTitleYear
9,087,701'Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP'20158,970,044'Integrated circuit packaging system with vertical interconnects and method of manufacture thereof'20158,883,561'Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP'20148,704,365'Integrated circuit packaging system having a cavity'20148,598,034'Package-on-package system with through vias and method of manufacture thereof'20138,460,968'Integrated circuit packaging system with post and method of manufacture thereof'20138,367,465'Integrated circuit package on package system'20138,334,601'Package-on-package system with through vias and method of manufacture thereof'20128,110,905'Integrated circuit packaging system with leadframe interposer and method of manufacture thereof'20128,008,787'Integrated circuit package system with delamination prevention structure'20117,989,950'Integrated circuit packaging system having a cavity'20117,986,048'Package-on-package system with through vias and method of manufacture thereof'20117,863,100'Integrated circuit packaging system with layered packaging and method of manufacture thereof'20117,482,203'Stacked integrated circuit package-in-package system'20097,312,519'Stacked integrated circuit package-in-package system'20077,298,037'Stacked integrated circuit package-in-package system with recessed spacer'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2015Patents assigned to STATS CHIPPAC LTD (16)· patent assignee history
2007–2015Based in Ichon-si, KR· patent location history
2007Based in Kyonggi-do, KR· patent location history
2011–2013Based in Seongnam-si, KR· patent location history
2012–2015Patents assigned to PARK DONGSAM (9)· patent assignee history
2012Patents assigned to CHO YOUNGSIK (1)· patent assignee history
2013Patents assigned to CHI HEEJO (1)· patent assignee history
2014–2015Patents assigned to LEE YONGDUK (3)· patent assignee history
2014–2015Based in Kyungki-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 16 | 2007–2015 |
| PARK DONGSAMself | 9 | 2012–2015 |
| LEE YONGDUK | 3 | 2014–2015 |
| CHI HEEJO | 1 | 2013 |
| CHO YOUNGSIK | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ichon-si, KR | 8 | 2007–2015 |
| Seongnam-si, KR | 5 | 2011–2013 |
| Kyungki-do, KR | 2 | 2014–2015 |
| Kyonggi-do, KR | 1 | 2007 |