Inventor
JONGBO SHIM
Inventor
KR
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices47%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%
H05KPrinted circuits2%
H10BElectronic memory devices2%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%
PatentTitleYear
12,575,413Semiconductor package202612,512,398Semiconductor package having semiconductor chip positioned in cavity of cover wiring structure202512,388,029Semiconductor package202512,261,157Semiconductor device having package on package structure and method of manufacturing the semiconductor device202512,261,093Semiconductor packages having a dam structure202512,148,729Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same202412,062,605Semiconductor package including an interposer and method of fabricating the same202412,033,924Semiconductor package202412,021,036Semiconductor package including interposer and method of manufacturing the semiconductor package202411,948,873Semiconductor package including a support solder ball202411,876,083Semiconductor package202411,854,989Semiconductor package substrate and semiconductor package including the same202311,804,477Semiconductor device having package on package structure and method of manufacturing the semiconductor device202311,798,889Methods of manufacturing semiconductor packages202311,728,230Semiconductor package and method of fabricating the same202311,710,673Interposer and semiconductor package including the same202311,676,949Semiconductor packages having supporting members202311,658,107Semiconductor package including an interposer and method of fabricating the same202311,581,263Semiconductor package, and package on package having the same202311,521,934Semiconductor package including interposer and method of manufacturing the semiconductor package202211,437,293Semiconductor packages having a dam structure202211,404,382Semiconductor package including an embedded semiconductor device202211,367,679Semiconductor package including an in interposer and method of fabricating the same202211,367,688Semiconductor package with interposer202211,367,714Semiconductor package device202211,152,416Semiconductor package including a redistribution line2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (26)· patent assignee history
2021–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 26 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 26 | 2021–2026 |