Inventor

John S. Fitch

Inventor
Los Altos, CA, US

Overview

63→
Patents
1992–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 63 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B41JTypewriters11%
H10NElectric solid-state devices not otherwise provided for9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B01LChemical or physical laboratory apparatus for general use3%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers3%
F15CFluid-circuit elements predominantly used for computing or control purposes2%
F16KValves2%
PatentTitleYear
10,713,978Bend limit film202010,338,390Method for fabricating a curved eyepiece20199,609,412'Bone-conduction anvil and diaphragm'20179,529,198'Opto-mechanical system for head-mounted device'20169,462,365'Structure and manufacture of bone-conduction transducer'20169,380,379'Bone-conduction anvil and diaphragm'20169,288,591'Bone-conduction anvil and diaphragm'20168,695,687'Hybrid pin-fin micro heat pipe heat sink and method of fabrication'20148,624,102'Metal trace fabrication for optical element'20148,579,414'Self-assembling structures for electrostatic extraction of pigments from liquid inks for marking'20138,389,851'Metal trace fabrication for optical element'20138,334,012'Method for preprinting and/or reliquifying subpixels to achieve color uniformity in color filters'20127,926,900'Method of printing with high spot placement accuracy'20117,775,246'Bio-ejector filling stops to facilitate efficient filling'20107,757,730'Bio-ejector filling stops to facilitate efficient filling'20107,574,787'Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure'20097,517,043'Fluidic structures'20097,387,139'Bio-ejector filling stops to facilitate efficient filling'20087,347,533'Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics'20087,293,411'Energy scavengers which adjust their frequency by altering liquid distributions on a beam'20077,290,336'Method of fabricating an array of multi-electroded piezoelectric transducers for piezoelectric diaphragm structures'20077,288,327'Plated structures or components'20077,282,129'Traveling wave algorithms to focus and concentrate proteins in gel electrophoresis'20077,246,958'Hand-propelled wand printer'20077,234,214'Methods for making thick film elements'20077,176,600'Poling system for piezoelectric diaphragm structures'20077,156,970'Distributed multi-segmented reconfigurable traveling wave grids for separation of proteins in gel electrophoresis'20077,150,813'Isoelectric focusing (IEF) of proteins with sequential and oppositely directed traveling waves in gel electrophoresis'20067,126,134'Sample manipulator'20067,089,635'Methods to make piezoelectric ceramic thick film arrays and elements'20067,091,650'Piezoelectric ceramic thick film element, array of elements, and devices'20067,084,555'Piezoelectric diaphragm structure with outer edge electrode'20067,057,330'Broad frequency band energy scavenger'20067,053,532'Radially poled piezoelectric diaphragm structures'20066,987,348'Piezoelectric transducers'20066,967,431'Piezoelectric transducers and methods of manufacture'20056,924,584'Piezoelectric transducers utilizing sub-diaphragms'20056,843,086'Magic keychain'20056,491,375'Integrated printhead'20026,484,975'Method and apparatus to achieve uniform ink temperatures in printheads'20026,464,337'Apparatus and method for acoustic ink printing using a bilayer printhead configuration'20026,317,321'Lap-top enclosure having surface coated with heat-absorbing phase-change material'20016,208,513'Independently mounted cooling fins for a low-stress semiconductor package'20016,149,123'Integrated electrically operable micro-valve'20006,138,748'Interleaved-fin thermal connector'20006,129,331'Low-power thermopneumatic microvalve'20006,034,430'Integrated thermal coupling for a heat generating device'20005,948,689'Integrated thermal coupling for heat generating device'19995,865,417'Integrated electrically operable normally closed valve'19995,838,065'Integrated thermal coupling for heat generating device'19985,787,976'Interleaved-fin thermal connector'19985,776,800'Paddleless molded plastic semiconductor chip package'19985,629,840'High powered die with bus bars'19975,604,376'Paddleless molded plastic semiconductor chip package'19975,582,242'Thermosiphon for cooling a high power die'19965,445,697'Fixture and method for attaching components'19955,386,143'High performance substrate, electronic package and integrated circuit cooling process'19955,247,426'Semiconductor heat removal apparatus with non-uniform conductance'19935,243,756'Integrated circuit protection by liquid encapsulation'19935,240,549'Fixture and method for attaching components'19935,203,401'Wet micro-channel wafer chuck and cooling method'19935,130,889'Integrated circuit protection by liquid encapsulation'19925,115,858'Micro-channel wafer cooling chuck'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–2000Patents assigned to DIGITAL EQUIPMENT CORP (16)· patent assignee history
1992–2001Based in Newark, CA, US· patent location history
2000–2020Based in Los Altos, CA, US· patent location history
2001Based in Santa Clara, CA, US· patent location history
2002–2013Patents assigned to XEROX CORP (7)· patent assignee history
2005–2014Patents assigned to PALO ALTO RES CT INC (26)· patent assignee history
2005Based in Stamford, CT, US· patent location history
2012–2014Patents assigned to FITCH JOHN S (4)· patent assignee history
2016–2019Patents assigned to GOOGLE INC (6)· patent assignee history
2016–2017Based in Mountain View, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PALO ALTO RES CT INC262005–2014
DIGITAL EQUIPMENT CORP161992–2000
XEROX CORP72002–2013
GOOGLE INC62016–2019
FITCH JOHN Sself42012–2014
Locations
LocationPatentsSpan
Los Altos, California, US372000–2020
Newark, California, US201992–2001
Mountain View, California, US42016–2017
Stamford, CT, US12005
Santa Clara, California, US12001