Inventor

Chuei-Tang Wang

Inventor

Taichung, TW

Overview

2006–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 104 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H01LSemiconductor devices28%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%

H01QAntennas, i.e. radio aerials9%

H10DInorganic electric semiconductor devices6%

H01FMagnets4%

H05KPrinted circuits3%

Y10TTechnical subjects covered by former us classification2%

G02BOptical elements, systems or apparatus1%

H02JElectric power networks1%

PatentTitleYear

10,879,183Semiconductor device and method of manufacture2020 10,872,878Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof2020 10,867,938Package structure2020 10,867,936Semiconductor device with shield for electromagnetic interference2020 10,847,304InFO coil on metal plate with slot2020 10,840,227Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device2020 10,825,602Stacked coil for wireless charging structure on InFO package2020 10,818,640Die stacks and methods forming same2020 10,811,404Package structure and method of manufacturing the same2020 10,804,953Method of using integrated transmitter and receiver front end module2020 10,796,990Semiconductor structure, package structure, and manufacturing method thereof2020 10,777,518Package structure and method of manufacturing the same2020 10,777,502Semiconductor chip, package structure, and pacakge-on-package structure2020 10,770,795Antenna device and method for manufacturing antenna device2020 10,763,229Semiconductor structure2020 10,763,164Package structure with inductor and method of forming thereof2020 10,756,052Method of manufacturing integrated fan-out package2020 10,734,323Package structures2020 10,727,082Semiconductor device and manufacturing method thereof2020 10,692,817Semiconductor device with shielding structure for cross-talk reduction2020 10,679,968Package with thinned substrate2020 10,679,947Chip package and manufacturing method thereof2020 10,672,728Integrated fan-out package2020 10,665,560Optical semiconductor package and method for manufacturing the same2020 10,643,943Package structure, package-on-package structure and manufacturing method thereof2020 10,622,701Antenna apparatus and method2020 10,559,517Heat transfer structures and methods for IC packages2020 10,515,851Method for forming semiconductor device structure with conductive shielding structure2019 10,510,478Stacked coil for wireless charging structure on InFO package2019 10,510,679Semiconductor device with shield for electromagnetic interference2019 10,510,660Semiconductor package devices integrated with inductor2019 10,510,682Semiconductor device with shield for electromagnetic interference2019 10,510,681Semiconductor device2019 10,510,714Packaged semiconductor devices and packaging methods2019 10,504,835Package structure, semiconductor chip and method of fabricating the same2019 10,497,668Integrated fan-out package including voltage regulators and methods forming same2019 10,498,0093D antenna for integrated circuits2019 10,481,351Semicondcutor packages2019 10,475,755Semiconductor structure2019 10,461,799Integrated transmitter and receiver front end module, transceiver, and related method2019 10,381,309Package structure having connecting module2019 10,371,893Hybrid interconnect device and method2019 10,366,966Method of manufacturing integrated fan-out package2019 10,332,841System on integrated chips and methods of forming the same2019 10,304,614Stacked coil for wireless charging structure on InFO package2019 10,304,790Method of fabricating an integrated fan-out package2019 10,297,925Semiconductor device including integrated fan out antenna and method of forming the same2019 10,276,4013D shielding case and methods for forming the same2019 10,269,481Stacked coil for wireless charging structure on InFO package2019 10,270,172Embedding low-k materials in antennas2019 10,269,732Info package with integrated antennas or inductors2019 10,269,728Semiconductor device with shielding structure for cross-talk reduction2019 10,267,990Hybrid interconnect device and method2019 10,162,139Semicondcutor package2018 10,163,854Package structure and method for manufacturing thereof2018 10,163,824Integrated fan-out package and method of fabricating the same2018 10,163,751Heat transfer structures and methods for IC packages2018 10,163,852Integrated fan-out package including voltage regulators and methods forming same2018 10,157,834Electronic apparatus2018 10,157,791Through-vias and methods of forming the same2018 10,153,239Antennas and waveguides in InFO structures2018 10,134,708Package with thinned substrate2018 10,128,203Fan-out package structure, antenna system and associated method2018 10,115,685Method of manufacturing a semiconductor structure2018 10,109,605Polymer layers embedded with metal pads for heat dissipation2018 10,090,243Inductor for semiconductor integrated circuit2018 10,074,472InFO coil on metal plate with slot2018 10,050,013Packaged semiconductor devices and packaging methods2018 10,043,761Semiconductor device and manufacturing method thereof2018 10,043,745Semiconductor package devices integrated with inductor2018 9,985,336Antenna apparatus and method2018 9,953,936Semiconductor structure and manufacturing method thereof2018 9,893,042'Semiconductor device and method'2018 9,859,778'Energy harvesting device'2018 9,843,106'Integrated fan out antenna and method of forming the same'2017 9,831,148Integrated fan-out package including voltage regulators and methods forming same2017 9,818,722'Package structure and method for manufacturing thereof'2017 9,818,698'EMI package and method for making same'2017 9,773,730'Semiconductor arrangement and formation thereof'2017 9,767,957'Method of manufacturing a tunable three dimensional inductor'2017 9,761,553'Inductor with conductive trace'2017 9,735,118'Antennas and waveguides in InFO structures'2017 9,698,071'Die packages and methods of manufacture thereof'2017 9,640,457'Power amplifier package and method thereof'2017 9,601,439'Semiconductor structure and manufacturing method thereof'2017 9,537,205'3D antenna for integrated circuits'2017 9,431,369'Antenna apparatus and method'2016 9,406,648'Power supply arrangement for semiconductor device'2016 9,407,184'Energy harvesting device'2016 9,396,300'Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof'2016 9,391,350'RF choke device for integrated circuits'2016 9,373,605'DIE packages and methods of manufacture thereof'2016 9,368,454'Semiconductor device with shielding layer in post-passivation interconnect structure'2016 9,355,956'Inductor for semiconductor integrated circuit'2016 9,337,073'3D shielding case and methods for forming the same'2016 9,331,018'Semiconductor arrangement and formation thereof'2016 9,275,950'Bead for 2.5D/3D chip packaging application'2016 9,252,491'Embedding low-k materials in antennas'2016 9,082,761'Polymer layers embedded with metal pads for heat dissipation'2015 9,018,757'Mechanisms for forming bump structures over wide metal pad'2015 8,916,979'Through-vias and methods of forming the same'2014 8,872,312'EMI package and method for making same'2014 7,312,518'Miniaturized multi-chip module and method for manufacturing the same'2007 7,106,259'Planar inverted-F antenna'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2020Based in Taichung, TW· patent location history

2014–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (9)· patent assignee history

2014–2016Patents assigned to WANG CHUEI-TANG (2)· patent assignee history

2014–2016Patents assigned to YEH DER-CHYANG (2)· patent assignee history

2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (93)· patent assignee history

2016Patents assigned to CHEN HUAN-NENG (1)· patent assignee history

2017–2018Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	93	2015–2020
TAIWAN SEMICONDUCTOR MFG	9	2014–2016
WANG CHUEI-TANGself	2	2014–2016
YEH DER-CHYANG	2	2014–2016
CHEN HUAN-NENG	1	2016

Locations

Location	Patents	Span
Taichung, TW	101	2006–2020
Hsinchu, TW	3	2017–2018