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Inventor

Chia-Yeh Huang

Inventor
Hsinchu, TW

Overview

2→
Patents
2014–2015
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
9,059,260'Semiconductor manufacturing method and semiconductor structure thereof'20158,823,169'Semiconductor manufacturing method and semiconductor structure thereof'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2015Patents assigned to CHIPBOND TECHNOLOGY CORP (2)· patent assignee history
2014–2015Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP22014–2015
Locations
LocationPatentsSpan
Hsinchu, TW22014–2015