Inventor

Weng-Yi Chen

Inventor
Zhubei City, TW

Overview

20→
Patents
2000–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices21%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers7%
H10DInorganic electric semiconductor devices7%
C23CCoating metallic material5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
H01LSemiconductor devices4%
H10BElectronic memory devices4%
PatentTitleYear
11,008,794Damper device and hinge assembly including the same202110,870,576Semiconductor sensor and method of manufacturing the same202010,773,953MEMS structure and method of fabricating the same202010,737,932Micro-electro-mechanical system structure and method for fabricating the same202010,640,368Semiconductor sensor and method of manufacturing the same202010,475,640Method for manufacturing semiconductor device201910,457,546Micro-electro-mechanical system structure and method for forming the same201910,427,935Manufacturing method for semiconductor structure201910,112,825Semiconductor structure and manufacturing method for the same201810,115,582Semiconductor device and method for manufacturing the same20189,961,450Piezoresistive microphone and method of fabricating the same20189,950,920Micro-electro-mechanical system structure and method for forming the same20189,790,088'MEMS structure and method of fabricating the same'20176,315,834'Method for removing extraneous matter by using fluorine-containing solution'20016,221,747'Method of fabricating a conductive plug with a low junction resistance in an integrated circuit'20016,207,498'Method of fabricating a coronary-type capacitor in an integrated circuit'20016,129,950'Method of forming a thick polysilicon layer'20006,121,114'Method for preparing a dummy wafer'20006,077,761'Method for fabricating a transistor gate with a T-like structure'20006,051,464'Method for fabricating a capacitor of a DRAM with an HSG layer'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2020Patents assigned to UNITED MICROELECTRONICS CORP (15)· patent assignee history
2000–2001Patents assigned to UNITED INTEGRATED CIRCUITS CORP (4)· patent assignee history
2000Patents assigned to UNITED INTEGRATED CIRCUIT CORP (1)· patent assignee history
2000–2001Based in Jhubei City, TW· patent location history
2001Patents assigned to UTEK SEMICONDUCTOR CORP (1)· patent assignee history
2001Based in Jubei, TW· patent location history
2017–2020Based in Hsinchu County, TW· patent location history
2018–2020Based in Zhubei City, TW· patent location history
2021Patents assigned to CHEN WATERSON (1)· patent assignee history
2021Based in Taichung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNITED MICROELECTRONICS CORP152000–2020
UNITED INTEGRATED CIRCUITS CORP42000–2001
CHEN WATERSONself12021
UNITED INTEGRATED CIRCUIT CORP12000
UTEK SEMICONDUCTOR CORP12001
Locations
LocationPatentsSpan
Zhubei City, TW82018–2020
Jhubei City, TW62000–2001
Hsinchu County, TW42017–2020
Taichung, TW12021
Jubei, TW12001