Inventor

Tadashi Arai

Inventor
Nagano, JP

Overview

79→
Patents
1978–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 79 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H05KPrinted circuits7%
H01LSemiconductor devices6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
G06FElectric digital data processing4%
H10KOrganic electric solid-state devices3%
G01QScanning-probe techniques or apparatus2%
PatentTitleYear
10,424,428Super-conducting wire, super-conducting coil, and magnetic resonance imaging device201910,290,570Wiring substrate201910,282,487Mask data generation method201910,134,680Electronic part embedded substrate and method of producing an electronic part embedded substrate201810,121,695Semiconductor device20189,811,623'Method for generating pattern, storage medium, and information processing apparatus'20179,768,122'Electronic part embedded substrate and method of producing an electronic part embedded substrate'20179,672,300'Pattern generation method'20179,569,576'Mask pattern generating method, storage medium, information processing apparatus for execution of the same, mask manufacturing method and device manufacturing method'20179,547,230'Method for evaluating optical image of pattern, recording medium, and information processing apparatus'20179,502,306'Pattern formation method that includes partially removing line and space pattern'20169,490,221'Semiconductor device having multiple magnetic shield members'20169,466,784'Semiconductor device having multiple magnetic shield members'20169,451,702'Chip embedded substrate and method of producing the same'20169,372,408'Mask pattern generation method'20169,257,354'Wiring substrate, light emitting device, and method for manufacturing wiring substrate'20168,945,801'Method for creating mask data, program, information processing apparatus, and method for manufacturing mask'20158,941,139'Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same'20158,941,813'Evaluation method, adjustment method, exposure apparatus, and memory medium'20158,943,446'Generation method, storage medium and information processing apparatus'20158,901,580'Package for mounting electronic components, electronic apparatus, and method for manufacturing the package'20148,793,868'Chip embedded substrate and method of producing the same'20148,786,065'Substrate, light emitting device and method for manufacturing substrate'20148,756,536'Generation method, storage medium, and information processing apparatus'20148,701,053'Decision method, storage medium and information processing apparatus'20148,686,548'Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate'20148,674,514'Wiring board, manufacturing method of the wiring board, and semiconductor package'20148,610,268'Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element'20138,520,190'Evaluation method, control method, exposure apparatus, and memory medium'20138,482,117'Semiconductor device with electronic component incorporation substrate'20138,436,249'Wiring substrate, electronic device, and method of manufacturing wiring substrate'20138,436,333'Silicon light emitting diode, silicon optical transistor, silicon laser and its manufacturing method'20138,321,816'Program storage medium and method for determining exposure condition and mask pattern'20128,143,531'Electronic component mounting package'20128,120,070'Wiring board and method for manufacturing the same'20128,102,048'Electronic device manufacturing method and electronic device'20128,035,804'Exposure apparatus and device manufacturing method'20118,013,327'Electronic device'20118,008,654'Thin-film transistor device and a method for manufacturing the same'20117,989,143'Method of manufacturing a semiconductor device having an organic thin film transistor'20117,989,707'Chip embedded substrate and method of producing the same'20117,985,619'Manufacturing method for semiconductor device embedded substrate'20117,981,724'Manufacturing method for semiconductor device embedded substrate'20117,944,039'Semiconductor device and method of manufacturing the same'20117,915,078'Manufacturing method for semiconductor device embedded substrate'20117,901,986'Wiring substrate, manufacturing method thereof, and semiconductor device'20117,872,257'Organic thin film transistor array and method of manufacturing the same'20117,827,681'Method of manufacturing electronic component integrated substrate'20107,749,889'Manufacturing method of semiconductor device'20107,700,403'Manufacturing method of semiconductor device'20107,642,145'Method for producing electronic device'20107,585,713'Method for exposing photo-sensitive SAM film and method for manufacturing semiconductor device'20097,575,952'Manufacturing method of semiconductor device having organic semiconductor film'20097,337,656'Surface characteristic analysis apparatus'20087,312,536'Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same'20077,250,329'Method of fabricating a built-in chip type substrate'20077,109,072'Semiconductor material, field effect transistor and manufacturing method thereof'20067,005,216'Photo mask'20066,953,519'Method of manufacturing the multi-tip probe, a multi-tip probe, and surface characteristic analysis apparatus'20056,932,504'Heated self-detecting type cantilever for atomic force microscope'20056,909,323'Variable gain amplifier'20056,790,564'Photomask and manufacturing method of an electronic device therewith'20046,690,232'Variable gain amplifier'20046,577,188'Variable gain amplifier'20036,481,545'Vibration damping shim structure'20026,469,293'Multiprobe and scanning probe microscope'20026,437,643'Variable gain amplifier'20026,422,069'Self-exciting and self-detecting probe and scanning probe apparatus'20025,872,579'Ink-jet printing method and apparatus therefor'19995,610,547'Logarithmic transformation circuitry for use in semiconductor integrated circuit devices'19975,465,070'Logarithmic transformation circuitry for use in semiconductor integrated circuit devices'19954,922,274'Motor driven exposure adjusting device'19904,897,681'Exposure amount adjusting device'19904,892,731'Biological intestinal antiseptics'19904,837,149'Novel saframycin A derivatives and process for producing the same'19894,372,947'Antibiotic saframycin S and process for producing the same'19834,248,863'Antibiotics saframycins A, B, C, D and E and process for producing the same'19814,127,446'Process for producing antibiotics mimosamycin and chlorocarcins A, B and C'19784,081,531'Antibiotic mimosamycin'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–2015Patents assigned to ARAI TADASHI (19)· patent assignee history
1978–2019Based in Tokyo, JP· patent location history
1990–2019Patents assigned to CANON KK (17)· patent assignee history
1990–2017Based in Saitama, JP· patent location history
1995–2005Patents assigned to TOSHIBA KK (6)· patent assignee history
2004–2013Based in Kumagaya, JP· patent location history
2006–2019Patents assigned to HITACHI LTD (12)· patent assignee history
2007–2019Patents assigned to SHINKO ELECTRIC IND CO (29)· patent assignee history
2007–2019Based in Nagano, JP· patent location history
2011–2019Based in Utsunomiya, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SHINKO ELECTRIC IND CO292007–2019
ARAI TADASHIself191978–2015
CANON KK171990–2019
HITACHI LTD122006–2019
TOSHIBA KK61995–2005
Locations
LocationPatentsSpan
Nagano, JP292007–2019
Kumagaya, JP132004–2013
Utsunomiya, JP102011–2019
Tokyo, JP71978–2019
Saitama, JP71990–2017