Inventor
Sei-Ping Louh
Inventor
New Taipei, TW
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus12%
B82YSpecific uses or applications of nanostructures9%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices9%
B29DProducing particular articles from plastics or from substances in a plastic state7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B29CShaping or joining of plastics6%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
PatentTitleYear
9,770,827'Robot control system'20179,636,826'Interactive personal robot'20179,568,658'Backlight module and method for manufacturing the same'20179,438,973'Speaker'2016D0761894'Pressure interactive robot'20169,398,358'Speaker and display having same'20168,917,446'Display device with plural screens'20148,906,748'Method for packaging a semiconductor structure'20148,804,242'Polarizer and fabrication method thereof'20148,693,094'Polarizer and fabrication method thereof'20148,354,047'Method for press molding lens array'20138,323,434'Method for manufacturing spherical Fresnel lens'20128,298,841'Method for manufacturing light emitting diode package'20128,256,926'Illumination device'20128,246,257'Optical fiber connector'20128,217,506'Semiconductor packaging structure having conductive gel to package semiconductor device'20128,207,549'Light emitting diode package and method for manufacturing same'20128,202,451'Method of making a lens assembly array'20128,071,276'Method for making alignment mark on substrate'20118,070,991'Method of molding lens array'20118,049,874'Method for measuring illuminance of lamp'20118,016,582'Apparatus and method for manufacturing optical elements'20117,989,149'Mold core and method for fabricating mold core'20117,988,890'Method for manufacturing lens mold'20117,988,536'Grinding method for grinding workpieces'20117,988,899'Stamper and method for making soft mold'20117,794,646'Method for manufacturing mold used in impression process'20107,796,336'Lens, lens array and method for making lens array'20107,712,928'Street illuminating device'20107,608,387'Method for fabricating mold core'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2017Patents assigned to HON HAI PREC IND CO LTD (30)· patent assignee history
2009–2014Based in Taipei, TW· patent location history
2011–2014Patents assigned to LOUH SEI-PING (12)· patent assignee history
2011–2012Based in Tu-Cheng, TW· patent location history
2012–2017Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HON HAI PREC IND CO LTD | 30 | 2009–2017 |
| LOUH SEI-PINGself | 12 | 2011–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 10 | 2012–2017 |
| Taipei, TW | 10 | 2009–2014 |
| Tu-Cheng, TW | 10 | 2011–2012 |