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Inventor

Yen-Ping Wang

Inventor
Changhua County, TW

Overview

56→
Patents
2003–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 56 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10DInorganic electric semiconductor devices8%
H05BElectric heating6%
H05KPrinted circuits4%
H01FMagnets3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
H03KPulse technique2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
10,867,957Mechanisms for forming hybrid bonding structures with elongated bumps202010,770,313Integrated fan-out package and manufacturing method thereof202010,748,861Package structure and manufacturing method thereof202010,727,082Semiconductor device and manufacturing method thereof202010,522,437Methods and apparatus for package with interposers201910,510,681Semiconductor device201910,312,209Manufacturing method of semiconductor package201910,276,404Integrated fan-out package201910,269,588Integrated circuit underfill scheme201910,269,640Method for singulating packaged integrated circuits and resulting structures201910,170,444Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices201910,163,854Package structure and method for manufacturing thereof201810,163,846Mechanisms for forming hybrid bonding structures with elongated bumps201810,043,761Semiconductor device and manufacturing method thereof201810,037,959Semiconductor structure and manufacturing method thereof20189,966,321Methods and apparatus for package with interposers20189,953,966Semiconductor device and method of forming the same20189,953,942Semiconductor packaging and manufacturing method thereof20189,941,240Semiconductor chip scale package and manufacturing method thereof20189,875,913Method for singulating packaged integrated circuits and resulting structures20189,818,722'Package structure and method for manufacturing thereof'20179,806,045'Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface'20179,653,417'Method for singulating packaged integrated circuits and resulting structures'20179,627,325'Package alignment structure and method of forming same'20179,596,729'Dimmable switching mode LED driving circuit without phase angle measurement'20179,559,071'Mechanisms for forming hybrid bonding structures with elongated bumps'20179,543,263'Semiconductor packaging and manufacturing method thereof'20179,497,861'Methods and apparatus for package with interposers'20169,472,523'Semiconductor structure and manufacturing method thereof'20169,397,056'Semiconductor device having trench adjacent to receiving area and method of forming the same'20169,355,924'Integrated circuit underfill scheme'20169,337,154'Semiconductor device and method of manufacturing the same'20169,263,405'Semiconductor device'20169,184,143'Semiconductor device with bump adjustment and manufacturing method thereof'20159,064,873'Singulated semiconductor structure'20158,759,185'Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same'20148,603,911'Semiconductor device and fabrication method thereof'20138,564,363'Pulse filter and bridge driver using the same'20138,450,940'Gas-discharge lamp controller utilizing a novel preheating phase control mechanism'20138,304,665'Package substrate having landless conductive traces'20128,217,583'Gas-discharge lamp controller utilizing a novel reheating frequency generation mechanism'20128,097,924'Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same'20128,067,904'Electronic ballast with dimming control from power line sensing'20118,054,149'Monolithic inductor'20117,999,495'Electronic ballast with dimming control from power line sensing'20117,999,494'Electronic ballast with dimming control from power line sensing'20117,982,413'Electronic ballast with dimming control from power line sensing'20117,867,860'Strained channel transistor formation'20117,727,845'Ultra shallow junction formation by solid phase diffusion'20107,719,325'Active-load dominant circuit for common-mode glitch interference cancellation'20107,615,426'PMOS transistor with discontinuous CESL and method of fabrication'20097,498,641'Partial replacement silicide gate'20097,429,907'Power inductor with heat dissipating structure'20087,285,833'Selective doping and thermal annealing method for forming a gate electrode pair with different work functions'20077,018,883'Dual work function gate electrodes'20066,569,346'Ferrite with high permeability and high dielectric constant and method for making the same'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2011Patents assigned to IND TECH RES INST (3)· patent assignee history
2006–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (14)· patent assignee history
2006–2017Based in Taipei, TW· patent location history
2010–2013Patents assigned to GRENERGY OPTO INC (7)· patent assignee history
2011–2014Patents assigned to WANG YEN-PING (8)· patent assignee history
2011Based in Hsinchu, TW· patent location history
2012–2013Based in Taichung, TW· patent location history
2015–2020Based in Changhua County, TW· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (28)· patent assignee history
2016–2020Based in Hemei Township, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD282016–2020
TAIWAN SEMICONDUCTOR MFG142006–2016
WANG YEN-PINGself82011–2014
GRENERGY OPTO INC72010–2013
IND TECH RES INST32003–2011
Locations
LocationPatentsSpan
Changhua County, TW222015–2020
Taipei, TW132006–2017
Hemei Township, TW122016–2020
Hsinchu, TW52011
Taichung, TW22012–2013