Inventor

Gustav E. Derkits, Jr.

Inventor
New Providence, NJ, US

Overview

35→
Patents
1979–2006
Patent span
Electricity
Primary field (CPC H)

Patents· 35 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Sprimary
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light14%
G02BOptical elements, systems or apparatus10%
H10DInorganic electric semiconductor devices10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B23KSoldering or unsoldering5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G01BMeasuring length, thickness or similar linear dimensions3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
PatentTitleYear
7,009,299'Kinetically controlled solder'20066,835,984'ESD resistant device'20046,625,367'Optoelectronic device having a P-contact and an N-contact located over a same side of a substrate and a method of manufacture therefor'20036,590,913'Barrier layer and method of making the same'20036,555,457'Method of forming a laser circuit having low penetration ohmic contact providing impurity gettering and the resultant laser circuit'20036,520,348'Multiple inclined wafer holder for improved vapor transport and reflux for sealed ampoule diffusion process'20036,489,232'ESD resistant device'20026,490,033'Method of thin film process control and calibration standard for optical profilometry step height measurement'20026,437,868'In-situ automated contactless thickness measurement for wafer thinning'20026,342,442'Kinetically controlled solder bonding'20026,320,265'Semiconductor device with high-temperature ohmic contact and method of forming the same'20016,255,707'Semiconductor laser reliability test structure and method'20016,253,005'Apparatus and method for compensating for misalignment in reflective packages'20016,249,619'Optical isolator'20016,222,863'Article comprising a stable, low-resistance ohmic contact'20016,210,546'Fixture with at least one trough and method of using the fixture in a plasma or ion beam'20016,184,582'Article comprising a standoff complaint metallization and a method for making same'20016,146,909'Detecting trace levels of copper'20006,112,000'Reflective array multiplexer with polarization compensation'20006,064,522'Miniature mass producible non-reciprocal devices'20006,015,998'Flexibility control in optical materials'20005,995,293'Optical components having magnetic thin films for orientation and method of assembling same'19995,990,560'Method and compositions for achieving a kinetically controlled solder bond'19995,989,637'Method for preventing facet coating overspray'19995,861,665'Structure for absorption of hydrogen in a package'19995,744,733'Method for testing and screening electronic and photonic packages for hydrogen damage susceptibility'19985,559,817'Complaint layer metallization'19965,079,130'Partially or fully recessed microlens fabrication'19924,758,534'Process for producing porous refractory metal layers embedded in semiconductor devices'19884,755,663'Textured surface, graded gap switch for transmission line optical detectors'19884,683,484'Lateral confinement of charge carriers in a multiple quantum well structure'19874,672,405'Multiple quantum well frequency multiplier circuit'19874,637,129'Selective area III-V growth and lift-off using tungsten patterning'19874,602,352'Apparatus and method for detection of infrared radiation'19864,167,791'Non-volatile information storage arrays of cryogenic pin diodes'1979

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1979Based in Pittsburgh, PA, US· patent location history
1986–2006Based in New Providence, NJ, US· patent location history
1987–1988Patents assigned to BELL COMMUNICATIONS RES (4)· patent assignee history
1996–2003Patents assigned to LUCENT TECHNOLOGIES INC (15)· patent assignee history
2002–2006Patents assigned to AGERE SYSTEMS INC (3)· patent assignee history
2002Patents assigned to AGERE SYST GUARDIAN CORP (2)· patent assignee history
2003Patents assigned to TRIQUINT TECHNOLOGY HOLDING CO (3)· patent assignee history
2003Based in Union, NJ, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LUCENT TECHNOLOGIES INC151996–2003
BELL COMMUNICATIONS RES41987–1988
AGERE SYSTEMS INC32002–2006
TRIQUINT TECHNOLOGY HOLDING CO32003
AGERE SYST GUARDIAN CORP22002
Locations
LocationPatentsSpan
New Providence, New Jersey, US331986–2006
Union, New Jersey, US12003
Pittsburgh, Pennsylvania, US11979