Inventor

Rodney C. Langley

Inventor
Boise, ID, US

Overview

12→
Patents
1993–2009
Patent span
Electricity
Primary field (CPC H)

Patents· 12 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1044%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H01JElectric discharge tubes or discharge lamps11%
Y10TTechnical subjects covered by former us classification11%
C23CCoating metallic material6%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2009Patents assigned to MICRON TECHNOLOGY INC (11)· patent assignee history
1993–2009Based in Boise, ID, US· patent location history
1994Patents assigned to MICRON SEMICONDUCTOR INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC111993–2009
MICRON SEMICONDUCTOR INC11994
Locations
LocationPatentsSpan
Boise, ID, US121993–2009