Inventor
RAASHINA HUMAYUN
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
C23CCoating metallic material19%
H10BElectronic memory devices13%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
12,444,651Tungsten feature fill with nucleation inhibition202512,331,396Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition202511,901,227Feature fill with nucleation inhibition202411,827,976Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition202311,670,516Metal-containing passivation for high aspect ratio etch202311,410,883Tungsten feature fill with nucleation inhibition202211,348,795Metal fill process for three-dimensional vertical NAND wordline2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to LAM RES CORP (5)· patent assignee history
2022–2025Patents assigned to NOVELLUS SYSTEMS INC (2)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 5 | 2022–2025 |
| NOVELLUS SYSTEMS INC | 2 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2025 |