Inventor
Helen H. Zhu
Inventor
Fremont, CA, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1044%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01JElectric discharge tubes or discharge lamps10%
H01LSemiconductor devices8%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
H10DInorganic electric semiconductor devices6%
C07CAcyclic or carbocyclic compounds2%
C07DHeterocyclic compounds2%
H05HPlasma technique2%
PatentTitleYear
10,192,751Systems and methods for ultrahigh selective nitride etch20199,911,620'Method for achieving ultra-high selectivity while etching silicon nitride'20189,837,286Systems and methods for selectively etching tungsten in a downstream reactor20179,558,928'Contact clean in high-aspect ratio structures'20177,772,122'Sidewall forming processes'20107,541,475'Substituted thiazoles'20097,385,287'Preventing damage to low-k materials during resist stripping'20087,311,852'Method of plasma etching low-k dielectric materials'20077,288,488'Method for resist strip in presence of regular low k and/or porous low k dielectric materials'20077,226,852'Preventing damage to low-k materials during resist stripping'20077,202,177'Nitrous oxide stripping process for organosilicate glass'20077,129,171'Selective oxygen-free etching process for barrier materials'20067,049,052'Method providing an improved bi-layer photoresist pattern'20066,962,879'Method of plasma etching silicon nitride'20056,949,460'Line edge roughness reduction for trench etch'20056,949,469'Methods and apparatus for the optimization of photo resist etching in a plasma processing system'20056,916,697'Etch back process using nitrous oxide'20056,841,483'Unique process chemistry for etching organic low-k materials'20056,670,278'Method of plasma etching of silicon carbide'20036,297,163'Method of plasma etching dielectric materials'20016,090,304'Methods for selective plasma etch'20005,626,716'Plasma etching of semiconductors'19975,611,888'Plasma etching of semiconductors'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2019Patents assigned to LAM RES CORP (22)· patent assignee history
1997–2001Based in Milpitas, CA, US· patent location history
1997Based in Santa Clara, CA, US· patent location history
2003–2019Based in Fremont, CA, US· patent location history
2009Patents assigned to ABBOTT LAB (1)· patent assignee history
2009Based in South Bend, IN, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 22 | 1997–2019 |
| ABBOTT LAB | 1 | 2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fremont, California, US | 18 | 2003–2019 |
| Milpitas, California, US | 3 | 1997–2001 |
| South Bend, IN, US | 1 | 2009 |
| Santa Clara, California, US | 1 | 1997 |