Inventor

Hirofumi Sumi

Inventor

Kanagawa, JP

Overview

1993–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 49 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Nprimary

H04NPictorial communication, e.g. television20%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation19%

H01LSemiconductor devices12%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%

H10DInorganic electric semiconductor devices9%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%

G01TMeasurement of nuclear or x-radiation4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light2%

G01NInvestigating or analysing materials by determining their chemical or physical properties2%

PatentTitleYear

10,863,116Solid-state image capture device, image capture system, and object identification system2020 10,819,922Solid-state imaging element and imaging device2020 10,700,117Method for manufacturing image sensor2020 10,607,078Method, system, and medium having stored thereon instructions that cause a processor to execute a method for obtaining image information of an organism comprising a set of optical data2020 10,163,959Image sensor and method for manufacturing the same2018 10,063,784Imaging apparatus, an electronic device, and imaging method to uniformize distribution of incident light, and a photostimulated luminescence detection scanner2018 10,027,886Image-capturing device and electronic device2018 9,955,098Imaging element, imaging device, electronic device, and imaging method to improve speed of analog to digital conversion2018 9,706,150'Image pickup device and camera system with high precision at high speed pixel read'2017 9,653,509'Image sensor and electronic device'2017 9,568,618'Semiconductor photodetector and radial ray detector'2017 9,513,382'Image-capturing device and electronic device'2016 9,462,190'Imaging apparatus, an electronic device, and imaging method to uniformize distribution of incident light, and a photostimulated luminescence detection scanner'2016 9,344,656'Solid-state image sensor and camera system'2016 9,294,700'Imaging element, imaging device, electronic device, and imaging method'2016 9,202,830'Imaging element and camera system employing a high-concentration layer between a photodiode and an insulation layer, with the insulation layer being between the high-concentration layer and a well of an amplifying transistor'2015 9,100,603'Image pickup device and camera system'2015 9,100,601'Image pickup device and camera system'2015 9,088,741'Method of controlling semiconductor device, signal processing method, semiconductor device, and electronic apparatus'2015 8,711,261'Method of controlling semiconductor device, signal processing method, semiconductor device, and electronic apparatus'2014 8,488,030'Information acquiring method, information acquiring apparatus, semiconductor device comprising array of plurality of unit components for detecting physical quantity distribution, and semiconductor manufacturing method'2013 8,409,907'Method for manufacturing information aquiring semiconductor device'2013 8,149,302'Method of processing noise in image data, noise reduction unit, and imaging apparatus'2012 8,030,726'Solid-state image sensor and method for manufacturing thereof as well as semiconductor device and method for manufacturing thereof'2011 7,830,436'Method of controlling semiconductor device, signal processing method, semiconductor device, and electronic apparatus'2010 7,825,964'Method of processing noise in image data, noise reduction unit, and imaging apparatus'2010 7,531,781'Imager with image-taking portions optimized to detect separated wavelength components'2009 7,517,713'Solid-state image sensor and method for manufacturing thereof as well as semiconductor device and method for manufacturing thereof'2009 7,414,663'Imaging element, imaging device, camera module and camera system'2008 7,375,757'Imaging element, imaging device, camera module and camera system'2008 6,423,993'Solid-state image-sensing device and method for producing the same'2002 6,417,023'Method for producing solid-state image-sensing device'2002 6,140,229'Semiconductor apparatus and method of producing same'2000 6,022,798'Method of forming an interconnect using thin films of Ti and TiN'2000 6,022,805'Method of fabricating semiconductor device with a multi-layered interconnection structure having a low contact resistance'2000 5,940,699'Process of fabricating semiconductor device'1999 5,915,204'Method of manufacturing a semiconductor device including a metal silicide layer'1999 5,776,830'Process for fabricating connection structures'1998 5,763,948'Semiconductor apparatus including a tin barrier layer having a (III) crystal lattice direction'1998 5,700,722'Process for forming silicide plugs in semiconductor devices'1997 5,686,355'Method for forming film of refractory metal'1997 5,597,739'MOS transistor and method for making the same'1997 5,428,234'Semiconductor device'1995 5,399,526'Method of manufacturing semiconductor device by forming barrier metal layer between substrate and wiring layer'1995 5,397,744'Aluminum metallization method'1995 5,308,793'Method for forming interconnector'1994 5,290,731'Aluminum metallization method'1994 5,254,498'Method for forming barrier metal structure'1993 5,194,405'Method of manufacturing a semiconductor device having a silicide layer'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2020Patents assigned to SONY CORP (42)· patent assignee history

1993–2020Based in Kanagawa, JP· patent location history

2012–2016Patents assigned to SUMI HIROFUMI (7)· patent assignee history

2014–2015Patents assigned to KAWAHITO SHOJI (2)· patent assignee history

2014–2015Patents assigned to NAKAMURA NOBUO (2)· patent assignee history

2016–2018Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (6)· patent assignee history

2020Based in Tsukuba, JP· patent location history

2020Based in Yokohama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SONY CORP	42	1993–2020
SUMI HIROFUMIself	7	2012–2016
SONY SEMICONDUCTOR SOLUTIONS CORP	6	2016–2018
KAWAHITO SHOJI	2	2014–2015
NAKAMURA NOBUO	2	2014–2015

Locations

Location	Patents	Span
Kanagawa, JP	46	1993–2020
Tsukuba, JP	2	2020
Yokohama, JP	1	2020