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Inventor

Manabu Muraoka

Inventor
Tochigi, JP

Overview

4→
Patents
2018–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering31%
B05CApparatus for applying fluent materials to surfaces, in general15%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%
C09JAdhesives8%
C23CCoating metallic material8%
H01LSemiconductor devices8%
H05KPrinted circuits8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
PatentTitleYear
10,722,965Solder ball supplying method, solder ball supplying device, and solder bump forming method202010,391,589Flux applying device201910,137,538Liquid coating device201810,111,342Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2020Patents assigned to SENJU METAL INDUSTRY CO (4)· patent assignee history
2018Patents assigned to NITTA CORP (1)· patent assignee history
2018–2020Based in Tochigi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SENJU METAL INDUSTRY CO42018–2020
NITTA CORP12018
Locations
LocationPatentsSpan
Tochigi, JP42018–2020