Inventor
Teng HUANG
Inventor
CN
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10BElectronic memory devices20%
H10DInorganic electric semiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01RElectrically-conductive connections10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
12,482,995Electrical connector with a positively retained metallic cover202512,376,307Semiconductor structure, fabrication method and three-dimensional memory202512,362,223Semiconductor structure, fabrication method and three-dimensional memory202512,324,198Semiconductor device and manufacture method thereof2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025Patents assigned to YANGTZE MEMORY TECH CO LTD (3)· patent assignee history
2025Patents assigned to FOXCONN INTERCONNECT TECHNOLOGY LTD (1)· patent assignee history
2025Patents assigned to FUDING PREC COMPONENTS SHENZHEN CO LTD (1)· patent assignee history
2025Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| YANGTZE MEMORY TECH CO LTD | 3 | 2025 |
| FOXCONN INTERCONNECT TECHNOLOGY LTD | 1 | 2025 |
| FUDING PREC COMPONENTS SHENZHEN CO LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 4 | 2025 |