Inventor
PING-HUNG CHIANG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices37%
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H04BTransmission5%
H04LTransmission of digital information, e.g. telegraphic communication5%
H04WWireless communication networks5%
PatentTitleYear
12,538,768Semiconductor structure and fabrication method thereof202612,446,020Inter-bundle channel estimation and synchronization for downlink data reception202512,342,592Manufacturing method of high voltage semiconductor device202512,342,585Semiconductor structure and fabrication method thereof202512,310,071Semiconductor structure and fabrication method thereof202512,183,809Manufacturing method of semiconductor device202412,100,624Semiconductor device and method of fabricating the same202412,046,596Semiconductor structure and forming method thereof202411,923,435High voltage semiconductor device and manufacturing method thereof2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2026Patents assigned to UNITED MICROELECTRONICS CORP (8)· patent assignee history
2024–2026Based in TW· patent location history
2025Patents assigned to MEDIATEK INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 8 | 2024–2026 |
| MEDIATEK INC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2024–2026 |