Inventor
YASUSHI FUJII
Inventor
JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
B29CShaping or joining of plastics12%
H01LSemiconductor devices12%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts8%
B30BPresses in general8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering4%
C12MApparatus for enzymology or microbiology4%
F16JPistons4%
PatentTitleYear
11,732,357Substrate processing method and substrate processing apparatus202311,577,434Rotary compression-molding machine202311,551,933Substrate processing method and substrate processing apparatus202311,499,225Gas processing apparatus and gas processing method202211,472,071Rotary compression-molding machine202211,248,293Film-forming apparatus and film-forming method202211,236,297Method of producing cell culture chip2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to TOKYO ELECTRON LTD (4)· patent assignee history
2022–2023Patents assigned to KIKUSUI SEISAKUSHO LTD (2)· patent assignee history
2022Patents assigned to TOKYO OHKA KOGYO CO LTD (1)· patent assignee history
2022–2023Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 4 | 2022–2023 |
| KIKUSUI SEISAKUSHO LTD | 2 | 2022–2023 |
| TOKYO OHKA KOGYO CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 7 | 2022–2023 |