Inventor
RAJEEV BAJAJ
Inventor
US
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing18%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering14%
B29CShaping or joining of plastics12%
B24DTools for grinding, buffing or sharpening11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
B29LIndexing scheme associated with subclass b29c, relating to particular articles8%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts6%
H01LSemiconductor devices6%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
C09GPolishing compositions2%
PatentTitleYear
12,387,946Double-sided scrubber for substrate cleaning202512,023,853Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles202412,011,801Printing a chemical mechanical polishing pad202411,986,922Techniques for combining CMP process tracking data with 3D printed CMP consumables202411,980,992Integrated abrasive polishing pads and manufacturing methods202411,964,359Apparatus and method of forming a polishing article that has a desired zeta potential202411,965,103Additive manufacturing of polishing pads202411,958,162CMP pad construction with composite material properties using additive manufacturing processes202411,951,590Polishing pads with interconnected pores202411,911,870Polishing pads for high temperature processing202411,897,079Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity202411,878,389Structures formed using an additive manufacturing process for regenerating surface texture in situ202411,851,570Anionic polishing pads formed by printing processes202311,826,876Hydrophilic and zeta potential tunable chemical mechanical polishing pads202311,813,712Polishing pads having selectively arranged porosity202311,806,829Advanced polishing pads and related polishing pad manufacturing methods202311,772,229Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process202311,745,302Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process202311,724,362Polishing pads produced by an additive manufacturing process202311,685,014Formulations for advanced polishing pads202311,673,225Printing a chemical mechanical polishing pad202311,638,979Additive manufacturing of polishing pads202311,612,978Additive manufacturing of polishing pads202311,597,054Correction of fabricated shapes in additive manufacturing202311,597,052Temperature control of chemical mechanical polishing202311,530,478Method for forming a hydrophobic and icephobic coating202211,524,384Abrasive delivery polishing pads and manufacturing methods thereof202211,471,999Integrated abrasive polishing pads and manufacturing methods202211,470,956Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process202211,453,097Chemical mechanical polishing apparatus and methods202211,446,788Precursor formulations for polishing pads produced by an additive manufacturing process202211,241,839Integrating 3D printing into multi-process fabrication schemes202211,207,758Printing a chemical mechanical polishing pad202111,154,961Correction of fabricated shapes in additive manufacturing2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to APPLIED MATERIALS INC (33)· patent assignee history
2021–2025Based in US· patent location history
2025Patents assigned to YIELD ENG SYSTEMS INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 33 | 2021–2024 |
| YIELD ENG SYSTEMS INC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 34 | 2021–2025 |