Inventor
KRISHNA VASANTH VALAVALA
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10NElectric solid-state devices not otherwise provided for24%
H10BElectronic memory devices5%
H10DInorganic electric semiconductor devices5%
PatentTitleYear
12,581,938Package architecture for quasi-monolithic chip with backside power202612,347,780Integrated circuit package with flipped high bandwidth memory device202511,756,856Package architecture including thermoelectric cooler structures202311,694,942Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management202311,664,293Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios202311,658,095Bump integrated thermoelectric cooler202311,462,457Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (7)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2026 |