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Inventor

Masatake Nagaya

Inventor
Seto, JP

Overview

5→
Patents
1998–2014
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1044%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
B28DWorking stone or stone-like materials11%
H10DInorganic electric semiconductor devices11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
PatentTitleYear
8,758,087'Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus'20147,763,543'Method for manufacturing silicon carbide semiconductor apparatus'20106,710,435'Semiconductor device arrangement and method of fabricating the same'20046,060,344'Method for producing a semiconductor substrate'20005,851,846'Polishing method for SOI'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998Based in Nishikamo-gun, JP· patent location history
2000–2014Patents assigned to DENSO CORP (4)· patent assignee history
2000–2014Based in Seto, JP· patent location history
2014Patents assigned to INOMATA SUMITOMO (1)· patent assignee history
2014Patents assigned to KANO FUMIYOSHI (1)· patent assignee history
2014Patents assigned to KOUTAKE KYOHEI (1)· patent assignee history
2014Patents assigned to MORITA HIROMICHI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DENSO CORP42000–2014
INOMATA SUMITOMO12014
KANO FUMIYOSHI12014
KOUTAKE KYOHEI12014
MORITA HIROMICHI12014
Locations
LocationPatentsSpan
Seto, JP42000–2014
Nishikamo-gun, JP11998