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Inventor

Ryuichi Tanimoto

Inventor
Tokyo, JP

Overview

7→
Patents
2012–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 7 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
B24BMachines, devices, or processes for grinding or polishing22%
H01LSemiconductor devices22%
C09GPolishing compositions9%
C09KMaterials for miscellaneous applications, not provided for elsewhere9%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
11,075,085Wafer polishing method202110,710,209Wafer polishing apparatus and polishing head used for same202010,344,187Polishing composition and polishing method using the same20199,707,659'Method and apparatus for polishing workpiece'20178,932,952'Method for polishing silicon wafer and polishing liquid therefor'20158,877,643'Method of polishing a silicon wafer'20148,147,295'Method of polishing silicon wafer'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2021Patents assigned to SUMCO CORP (7)· patent assignee history
2012–2017Patents assigned to TANIMOTO RYUICHI (4)· patent assignee history
2012–2017Patents assigned to OGATA SHINICHI (3)· patent assignee history
2012–2014Patents assigned to KATOH TAKEO (2)· patent assignee history
2012–2014Patents assigned to TAKUSHIMA TAKERU (2)· patent assignee history
2012–2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SUMCO CORP72012–2021
TANIMOTO RYUICHIself42012–2017
OGATA SHINICHI32012–2017
KATOH TAKEO22012–2014
TAKUSHIMA TAKERU22012–2014
Locations
LocationPatentsSpan
Tokyo, JP72012–2021