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Inventor

Yoshitaka Terashima

Inventor
Fujisawa, JP

Overview

2→
Patents
2001–2004
Patent span
Chemistry
Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits40%
B05DProcesses for applying fluent materials to surfaces, in general20%
C23CCoating metallic material20%
C25DProcesses for the electrolytic or electrophoretic production of coatings20%
PatentTitleYear
6,800,188'Copper plating bath and plating method for substrate using the copper plating bath'20046,193,789'Electroless copper plating solution and method for electroless copper plating'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2004Patents assigned to EBARA UDYLITE KK (2)· patent assignee history
2001Patents assigned to HONMA HIDEO (1)· patent assignee history
2001–2004Based in Fujisawa, JP· patent location history
2004Patents assigned to EBARA CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA UDYLITE KK22001–2004
EBARA CORP12004
HONMA HIDEO12001
Locations
LocationPatentsSpan
Fujisawa, JP22001–2004