Inventor
Ryoji Matsuyama
Inventor
Kawasaki, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
B23KSoldering or unsoldering10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
7,717,317'Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method'20107,565,739'Method of making zinc-aluminum alloy connection'20097,425,765'Zinc-aluminum solder alloy'20086,238,283'Double-sealed work conveying and transferring apparatus and container inspecting method'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2010Patents assigned to FUJITSU LTD (4)· patent assignee history
2001–2010Based in Kawasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 4 | 2001–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 4 | 2001–2010 |