Inventor
Martin Lim
Inventor
San Mateo, CA, US
Overview
Patents· 59 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices29%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems27%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H01LSemiconductor devices5%
B41JTypewriters3%
G02BOptical elements, systems or apparatus3%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
H10DInorganic electric semiconductor devices2%
G01CMeasuring distances, levels or bearings2%
PatentTitleYear
10,850,973Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures202010,783,866Sound producing device202010,598,621Gas sensing device with chemical and thermal conductivity sensing202010,532,926Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures202010,508,022MEMS device and process for RF and low resistance applications201910,488,274Acoustic ambient temperature and humidity sensing201910,343,897Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same201910,221,065CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture201910,160,635MEMS device and process for RF and low resistance applications201810,093,533CMOS-MEMS-CMOS platform20189,933,319Acoustic ambient temperature and humidity sensing20189,878,902'Cavity pressure modification using local heating with a laser'20189,809,451'Capacitive sensing structure with embedded acoustic channels'20179,809,448'Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same'20179,802,815'Method for MEMS structure with dual-level structural layer and acoustic port'20179,796,580'CMOS-MEMS-CMOS platform'20179,738,512'CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture'20179,731,963'Method of increasing MEMS enclosure pressure using outgassing material'20179,718,679'Integrated heater for gettering or outgassing activation'20179,663,349'MEMS device with electrodes permeable to outgassing species'20179,650,241'Method for providing a MEMS device with a plurality of sealed enclosures having uneven standoff structures and MEMS device thereof'20179,617,141'MEMS device and process for RF and low resistance applications'20179,617,144'Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same'20179,621,975'Systems and apparatus having top port integrated back cavity micro electro-mechanical system microphones and methods of fabrication of the same'20179,611,133'Film induced interface roughening and method of producing the same'20179,556,019'Cavity pressure modification using local heating with a laser'20179,540,230'Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures'20179,452,925'Method of increasing MEMS enclosure pressure using outgassing material'20169,428,379'MEMS acoustic sensor with integrated back cavity'20169,344,808'Differential sensing acoustic sensor'20169,302,902'Integrated heater on MEMS cap for wafer scale packaged MEMS sensors'20169,227,842'Method for MEMS structure with dual-level structural layer and acoustic port'20169,221,676'Internal electrical contact for enclosed MEMS devices'20159,216,897'Capacitive sensing structure with embedded acoustic channels'20159,114,977'MEMS device and process for RF and low resistance applications'20159,035,428'Integrated structure with bidirectional vertical actuation'20158,945,969'Internal electrical contact for enclosed MEMS devices'20158,822,252'Internal electrical contact for enclosed MEMS devices'20148,692,340'MEMS acoustic sensor with integrated back cavity'20148,686,555'Integrated heater on MEMS cap for wafer scale packaged MEMS sensors'20148,564,076'Internal electrical contact for enclosed MEMS devices'20138,513,747'Integrated MEMS devices with controlled pressure environments by means of enclosed volumes'20138,395,381'Micromachined magnetic field sensors'20138,384,134'MEMS device including an electrical interconnect through a substrate'20138,350,346'Integrated MEMS devices with controlled pressure environments by means of enclosed volumes'20137,458,263'Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging'20087,250,353'Method and system of releasing a MEMS structure'20076,865,313'Bistable latching actuator for optical switching applications'20056,633,708'Micromachined apparatus and technique to align two dimensional fiber array'20036,549,107'Latching mechanism for MEMS actuator and method of fabrication'20036,477,290'Fiber optic switch using MEMS'20026,189,381'Angular rate sensor made from a structural wafer of single crystal silicon'20016,187,211'Method for fabrication of multi-step structures using embedded etch stop layers'20016,010,461'Monolithic silicon intra-ocular pressure sensor and method therefor'20005,821,958'Acoustic ink printhead with variable size droplet ejection openings'19985,631,678'Acoustic printheads with optical alignment'19975,565,113'Lithographically defined ejection units'19965,467,975'Apparatus and method for moving a substrate'19955,428,381'Capping structure'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2001Patents assigned to XEROX CORP (6)· patent assignee history
1995–1998Based in Union City, CA, US· patent location history
1995Based in Foster City, CA, US· patent location history
2000Based in Redwood City, CA, US· patent location history
2001–2020Based in San Mateo, CA, US· patent location history
2003–2005Patents assigned to OPTICNET INC (3)· patent assignee history
2007–2020Patents assigned to INVENSENSE INC (46)· patent assignee history
2013–2017Patents assigned to LIM MARTIN (5)· patent assignee history
2013–2017Patents assigned to HUANG KEGANG (2)· patent assignee history
2020Based in Hillsborough, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INVENSENSE INC | 46 | 2007–2020 |
| XEROX CORP | 6 | 1995–2001 |
| LIM MARTINself | 5 | 2013–2017 |
| OPTICNET INC | 3 | 2003–2005 |
| HUANG KEGANG | 2 | 2013–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Mateo, California, US | 52 | 2001–2020 |
| Union City, California, US | 4 | 1995–1998 |
| Hillsborough, California, US | 1 | 2020 |
| Redwood City, California, US | 1 | 2000 |
| Foster City, California, US | 1 | 1995 |