Inventor
Kuo-Yuh Yang
Inventor
Hsinchu County, TW
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10BElectronic memory devices4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
Y10TTechnical subjects covered by former us classification4%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding2%
H03FAmplifiers2%
PatentTitleYear
10,854,529High resistivity wafer with heat dissipation structure and method of making the same202010,679,944Semiconductor structure with high resistivity wafer and fabricating method of bonding the same202010,636,892Semiconductor structure and manufacturing method thereof202010,600,734Transistor structure in low noise amplifier202010,460,980Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the same201910,411,110Semiconductor structure and manufacturing method thereof201910,347,712Semiconductor device and method for fabricating the same20199,378,998'Semiconductor structure and method of forming a harmonic-effect-suppression structure'20169,048,285'Semiconductor structure and method of forming a harmonic-effect-suppression structure'20158,776,363'Method for supporting semiconductor wafer and wafer supporting assembly'20148,754,504'Thinned wafer and fabricating method thereof'20148,536,709'Wafer with eutectic bonding carrier and method of manufacturing the same'20138,519,500'Image sensor with correcting lens and fabrication thereof'20138,274,124'Backside illuminated image sensor'20126,495,417'Method for increasing tolerance of contact extension alignment in COB DRAM'20026,455,371'Method for forming capacitor of a DRAM having a wall protection structure'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2020Patents assigned to UNITED MICROELECTRONICS CORP (15)· patent assignee history
2002–2013Based in Hsinchu, TW· patent location history
2002Based in Jhubei City, TW· patent location history
2012–2014Patents assigned to YANG KUO-YUH (5)· patent assignee history
2012–2020Based in Hsinchu County, TW· patent location history
2013–2014Patents assigned to CHEN YAN-DA (3)· patent assignee history
2013–2014Patents assigned to HSU CHANG-SHENG (3)· patent assignee history
2013–2014Patents assigned to LIEN CHIA-WEN (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 15 | 2002–2020 |
| YANG KUO-YUHself | 5 | 2012–2014 |
| CHEN YAN-DA | 3 | 2013–2014 |
| HSU CHANG-SHENG | 3 | 2013–2014 |
| LIEN CHIA-WEN | 3 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 13 | 2012–2020 |
| Hsinchu, TW | 2 | 2002–2013 |
| Jhubei City, TW | 1 | 2002 |