Inventor
Da Hee Kim
Inventor
Suwon-si, KR
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H05KPrinted circuits8%
G06KGraphical data reading4%
G06VImage or video recognition or understanding4%
PatentTitleYear
10,872,863Semiconductor package202010,770,418Fan-out semiconductor package202010,692,805Semiconductor package202010,622,273Semiconductor package with improved flatness of an insulating layer formed on patterns202010,573,613Fan-out semiconductor package202010,522,451Fan-out semiconductor package201910,402,620Fan-out semiconductor package201910,403,583Fan-out semiconductor package201910,211,136Fan-out semiconductor package20199,706,668'Printed circuit board, electronic module and method of manufacturing the same'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2019Patents assigned to SAMSUNG ELECTRO MECH (2)· patent assignee history
2017Based in Seoul, KR· patent location history
2019–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (8)· patent assignee history
2019–2020Based in Suwon-si, KR· patent location history
2019Based in Gyeonggi-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 8 | 2019–2020 |
| SAMSUNG ELECTRO MECH | 2 | 2017–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 8 | 2019–2020 |
| Gyeonggi-do, KR | 1 | 2019 |
| Seoul, KR | 1 | 2017 |