LexDanaLexDanabeta
Inventor

CHI-WEN PAN

Inventor
TW

Overview

3→
Patents
2022–2023
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
G01RMeasuring electric variables17%
G06FElectric digital data processing17%
PatentTitleYear
11,762,439Method and apparatus of dynamic thermal management based on surface temperatures of portable device202311,728,232Semiconductor package having a stiffener ring202311,302,592Semiconductor package having a stiffener ring2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to MEDIATEK INC (3)· patent assignee history
2022–2023Based in TW· patent location history
2023Patents assigned to MEDIA TEK INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MEDIATEK INC32022–2023
MEDIA TEK INC12023
Locations
LocationPatentsSpan
TW32022–2023