Inventor

Fumio Mizuno

Inventor
Tokorozawa, JP

Overview

49→
Patents
1977–2012
Patent span
Physics
Primary field (CPC G)

Patents· 49 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Jprimary
H01JElectric discharge tubes or discharge lamps18%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices12%
G06TImage data processing or generation, in general12%
G01NInvestigating or analysing materials by determining their chemical or physical properties10%
C04BLime, magnesia9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G01BMeasuring length, thickness or similar linear dimensions7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
G01RMeasuring electric variables3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
8,304,724'Microstructured pattern inspection method'20128,217,466'High-speed semiconductor device and method for manufacturing the same'20127,804,111'Semiconductor device and method for adjusting characteristics thereof'20107,791,021'Microstructured pattern inspection method'20107,642,514'Charged particle beam apparatus'20107,435,959'Microstructured pattern inspection method'20087,329,868'Charged particle beam apparatus'20087,217,923'Microstructured pattern inspection method'20077,109,485'Charged particle beam apparatus'20066,936,819'Microstructured pattern inspection method'20056,936,818'Charged particle beam apparatus'20056,765,204'Microstructured pattern inspection method'20046,757,621'Process management system'20046,653,633'Charged particle beam apparatus'20036,573,499'Microstructured pattern inspection method'20036,542,830'Process control system'20036,538,249'Image-formation apparatus using charged particle beams under various focus conditions'2003RE037996'Manufacturing method or an exposing method for a semiconductor device or a semiconductor integrated circuit device and a mask used therefor'20036,157,451'Sample CD measurement system'20006,114,695'Scanning electron microscope and method for dimension measuring by using the same'20006,072,178'Sample analyzing apparatus'20006,067,153'Pattern defect inspecting apparatus'20006,047,083'Method of and apparatus for pattern inspection'20005,969,357'Scanning electron microscope and method for dimension measuring by using the same'19995,959,011'Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method'19995,866,904'Scanning electron microscope and method for dimension measuring by using the same'19995,777,327'Pattern shape inspection apparatus for forming specimen image on display apparatus'19985,750,990'Method for measuring critical dimension of pattern on sample'19985,736,300'Manufacturing method or an exposing method for a semiconductor device or a semiconductor integrated circuit device and a mask used therefor'19985,594,245'Scanning electron microscope and method for dimension measuring by using the same'19975,578,422'Manufacturing method or an exposing method for a semiconductor device or a semiconductor integrated circuit device and a mask used therefor'19965,512,361'Integrally molded polyurethane foam products'19965,466,325'Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method'19955,436,095'Manufacturing method or an exposing method for a semiconductor device for a semiconductor integrated circuit device and a mask used therefor'19955,412,210'Scanning electron microscope and method for production of semiconductor device by using the same'19955,405,810'Alignment method and apparatus'19955,272,122'BaO-xTiO.sub.2 dielectric ceramic composition'19935,198,396'Microwave dielectric ceramic composition'19935,155,092'Ceramic superconducting composition and process and apparatus for preparing thereof'19924,866,016'Alumina-based ceramic composition'19894,735,926'Alumina ceramic body'19884,720,471'Alumina porcelain compositions'19884,668,646'Alumina ceramic composition'19874,643,985'Dielectric porcelain material'19874,614,725'Alumina porcelain composition'19864,591,574'Alumina porcelain composition'19864,585,745'Dielectric ceramic composition for high frequency purposes'19864,118,794'Memory array with larger memory capacitors at row ends'19784,039,252'Field-effect liquid crystal-type display device'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–2012Patents assigned to HITACHI LTD (34)· patent assignee history
1986–1993Patents assigned to NGK SPARK PLUG CO (11)· patent assignee history
1986–1993Based in Nagoya, JP· patent location history
1986–1996Based in Aichi, JP· patent location history
1995–2003Patents assigned to HITACHI VLSI ENG (4)· patent assignee history
1995–1999Patents assigned to NITTO DENKO CORP (2)· patent assignee history
1995–2010Based in Tokorozawa, JP· patent location history
1995–1999Based in Tokyo, JP· patent location history
2010–2012Based in Hino, JP· patent location history
2012Patents assigned to MIZUNO FUMIO (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI LTD341978–2012
NGK SPARK PLUG CO111986–1993
HITACHI VLSI ENG41995–2003
MIZUNO FUMIOself22012
NITTO DENKO CORP21995–1999
Locations
LocationPatentsSpan
Tokorozawa, JP291995–2010
Nagoya, JP71986–1993
Aichi, JP51986–1996
Hino, JP22010–2012
Tokyo, JP21995–1999