Inventor
YONG HOON KIM
Inventor
KR
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H01LSemiconductor devices14%
A23KFodder3%
A23LFoods, foodstuffs or non-alcoholic beverages, not otherwise provided for3%
A23VIndexing scheme relating to foods, foodstuffs or non-alcoholic beverages and lactic or propionic acid bacteria used in foodstuffs or food preparation3%
A61KPreparations for medical, dental or toiletry purposes3%
A23DEdible oils or fats, e.g. margarines, shortenings or cooking oils1%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations1%
B82BNanostructures formed by manipulation of individual atoms, molecules, or limited collections of atoms or molecules as discrete units1%
PatentTitleYear
12,476,387Antenna substrate and electronic device including the same202512,361,244Validation of objects202512,293,996Semiconductor package including heat dissipation structure202512,211,591First-principles-derived effective mass approximation simulation method and system for accurate and efficient computational design of electronic structure and optical properties of quantum nanostructures202512,114,428Electronic component embedded substrate202412,108,534Substrate structure and electronic device including the same202412,108,535Printed circuit board and printed circuit board package202411,963,311Printed circuit board and method of manufacturing the same202411,894,191Multilayer electronic component202411,882,652Printed circuit board202411,770,898Substrate structure and electronic device including the same202311,765,833Substrate having electric component embedded therein202311,758,655Printed circuit board202311,751,335Printed circuit board202311,638,346Component package and printed circuit board for the same202311,607,433Composition for preventing, improving, or treating autism spectrum disorders including 202311,576,261Connection structure embedded substrate202311,542,468None202311,521,922Printed circuit board202211,439,020Electronic component-embedded substrate202211,350,529Substrate structure and electronic device including the same202211,343,917Air conditioner202211,309,280Semiconductor device package202211,284,515Electronic component embedded substrate202211,248,566Exhaust gas recirculation cooler202211,206,736Connection substrate and interposer substrate including the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to SAMSUNG ELECTRO MECH (19)· patent assignee history
2021–2025Based in KR· patent location history
2022Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2022Patents assigned to HYUNDAI MOTOR CO LTD (1)· patent assignee history
2023Patents assigned to HEALTHBIOME (2)· patent assignee history
2025Patents assigned to GOOGLE LLC (1)· patent assignee history
2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRO MECH | 19 | 2021–2025 |
| HEALTHBIOME | 2 | 2023 |
| SAMSUNG ELECTRONICS CO LTD | 2 | 2022 |
| GOOGLE LLC | 1 | 2025 |
| HYUNDAI MOTOR CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 25 | 2021–2025 |
| US | 1 | 2025 |