Inventor
ZHENGUO JIANG
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H05KPrinted circuits18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01QAntennas, i.e. radio aerials12%
G06FElectric digital data processing9%
H01FMagnets9%
H04BTransmission9%
H01PWaveguides3%
H01RElectrically-conductive connections3%
PatentTitleYear
12,200,855Radio frequency front-end structures202512,003,023In-package 3D antenna202411,937,367Radio frequency front-end structures202411,804,426Integrated circuit structures in package substrates202311,729,902Radio frequency front-end structures202311,611,164Wideband multi-pin edge connector for radio frequency front end module202311,482,471Thermal management solutions for integrated circuit packages2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (7)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2025 |