Inventor
Hideyo Haruhana
Inventor
Tokyo, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H03FAmplifiers14%
H03KPulse technique14%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
8,786,370'Power supply control circuit'20146,861,878'Chopper comparator'20056,611,042'Semiconductor device including resistors isolated and equdistant from diffusion regions'20036,445,071'Semiconductor device having an improved multi-layer interconnection structure and manufacturing method thereof'20026,165,878'Method of manufacturing semiconductor device'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2003Patents assigned to MITSUBISHI ELECTRIC CORP (3)· patent assignee history
2000–2005Based in Tokyo, JP· patent location history
2005Patents assigned to RENESAS TECH CORP (1)· patent assignee history
2014Patents assigned to HARUHANA HIDEYO (1)· patent assignee history
2014Patents assigned to KISHII TATSUYA (1)· patent assignee history
2014Patents assigned to ONO HIDEKAZU (1)· patent assignee history
2014Based in Hamamatsu, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 3 | 2000–2003 |
| HARUHANA HIDEYOself | 1 | 2014 |
| KISHII TATSUYA | 1 | 2014 |
| ONO HIDEKAZU | 1 | 2014 |
| RENESAS TECH CORP | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 4 | 2000–2005 |
| Hamamatsu, JP | 1 | 2014 |