Inventor

Jerry Ihor Tustaniwskyj

Inventor

Mission Viejo, CA, US

Overview

1978–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 48 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%

G01RMeasuring electric variables22%

H05KPrinted circuits9%

G05DSystems for controlling or regulating non-electric variables7%

H10DInorganic electric semiconductor devices5%

Y10TTechnical subjects covered by former us classification5%

H01RElectrically-conductive connections4%

G01MTesting static or dynamic balance of machines or structures3%

H01LSemiconductor devices3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

PatentTitleYear

11,039,528Assembly and sub-assembly for thermal control of electronic devices2021 10,782,316Socket side thermal system2020 10,770,317Leak tolerant liquid cooling system employing improved air purging mechanism2020 9,857,419'Micro-vision alignment system with guiding rings for IC testing'2018 9,733,151'System and method for accelerating a device'2017 9,500,701'Alignment mechanism'2016 9,010,188'System and method for accelerating a device'2015 8,628,240'Temperature measurement using a diode with saturation current cancellation'2014 7,373,967'Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits'2008 7,199,597'Dual feedback control system for maintaining the temperature of an IC-chip near a set-point'2007 7,004,243'Method of extending the operational period of a heat-exchanger in a chip tester'2006 6,995,980'Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module'2006 6,914,446'Chip tester having a heat-exchanger with an extendable period of operation'2005 6,822,465'Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent'2004 6,809,543'Abrupt power change method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint'2004 6,774,661'Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint'2004 6,658,736'Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent'2003 6,522,156'Planar subassembly for testing IC chips having faces with pressed electrical contacts that carry all power and signals for the chips'2003 6,412,551'System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chips'2002 6,362,944'System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater'2002 6,325,662'Apparatus for testing IC chips using a sliding springy mechanism which exerts a nearly constant force apparatus'2001 6,307,388'Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed together'2001 6,307,391'Pivoting springy mechanism that opens and closes pressed electrical contacts with a force which is nearly constant over a range of closed positions'2001 6,243,944'Residue-free method of assembling and disassembling a pressed joint with low thermal resistance'2001 6,196,299'Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its corners'2001 6,179,047'Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profile'2001 6,116,331'Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile'2000 6,108,208'Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules'2000 6,074,219'Electromechanical subassembly including a carrier with springy contacts that exert large and small contact forces'2000 6,042,388'Electromechanical module having a thin springy plate for establishing pressed electrical connections'2000 5,967,798'Integrated circuit module having springy contacts of at least two different types for reduced stress'1999 5,918,665'Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested'1999 5,844,208'Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature'1998 5,821,505'Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink'1998 5,579,205'Electromechanical module with post-solder attachable/removable heat sink frame and low profile'1996 5,441,195'Method of stretching solder joints'1995 5,424,580'Electro-mechanical assembly of high power and low power IC packages with a shared heat sink'1995 5,307,239'Electromechanical module with small footprint and post-solder attachable/removable heat sink frame'1994 5,019,943'High density chip stack having a zigzag-shaped face which accommodates connections between chips'1991 4,893,499'Method and apparatus for detecting leaks in IC packages by sensing package deflections'1990 4,879,629'Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation'1989 4,809,134'Low stress liquid cooling assembly'1989 4,807,019'Cavity-up-cavity-down multichip integrated circuit package'1989 4,721,996'Spring loaded module for cooling integrated circuit packages directly with a liquid'1988 4,698,728'Leak tolerant liquid cooling system'1987 4,677,370'Method of testing wire bonds for defects using a magnetic field'1987 4,506,941'Socket incorporating serially coupled springs'1985 4,129,892'Back-up pressure mechanism with tensioned elongated member'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–1985Patents assigned to BURROUGHS CORP (2)· patent assignee history

1978Based in Warren, MI, US· patent location history

1985–2021Based in Mission Viejo, CA, US· patent location history

1987–2006Patents assigned to UNISYS CORP (36)· patent assignee history

2007–2021Patents assigned to DELTA DESIGN INC (10)· patent assignee history

2014–2016Patents assigned to BABCOCK JAMES WITTMAN (3)· patent assignee history

2014–2016Patents assigned to TUSTANIWSKYJ JERRY IHOR (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
UNISYS CORP	36	1987–2006
DELTA DESIGN INC	10	2007–2021
BABCOCK JAMES WITTMAN	3	2014–2016
TUSTANIWSKYJ JERRY IHORself	3	2014–2016
BURROUGHS CORP	2	1978–1985

Locations

Location	Patents	Span
Mission Viejo, California, US	47	1985–2021
Warren, MI, US	1	1978