Inventor
Pi-Chen Shieh
Inventor
Hsinchu, TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
H10DInorganic electric semiconductor devices25%
PatentTitleYear
5,923,088'Bond pad structure for the via plug process'19995,712,207'Profile improvement of a metal interconnect structure on a tungsten plug'19985,700,735'Method of forming bond pad structure for the via plug process'19975,547,881'Method of forming a resistor for ESD protection in a self aligned silicide process'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–1999Patents assigned to TAIWAN SEMICONDUCTOR MFG (4)· patent assignee history
1996–1999Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 4 | 1996–1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 4 | 1996–1999 |