Inventor
SHEM OGADHOH
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices30%
H10DInorganic electric semiconductor devices30%
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
12,476,183Punch-through interconnect feature to couple upper electrodes of capacitors of multi-level memory arrays202512,446,208Multilevel wordline assembly for embedded DRAM202512,426,247Capacitor connections in dielectric layers202512,176,284Through plate interconnect for a vertical MIM capacitor202411,991,873Capacitor separations in dielectric layers202411,832,438Capacitor connections in dielectric layers202311,652,047Intermediate separation layers at the back-end-of-line202311,610,894Capacitor separations in dielectric layers202311,563,107Method of contact patterning of thin film transistors for embedded DRAM using a multi-layer hardmask202311,404,536Thin-film transistor structures with gas spacer2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (10)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 10 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2022–2025 |