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Inventor

Takahide Morishita

Inventor
Osaka, JP

Overview

1→
Patents
2020
Patent span
Chemistry
Primary field (CPC C)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds33%
C08LCompositions of macromolecular compounds33%
C09JAdhesives33%
PatentTitleYear
10,689,553Moisture-curable hot melt adhesive for lighting appliances2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020Patents assigned to HENKEL AG & CO KGAA (1)· patent assignee history
2020Based in Osaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HENKEL AG & CO KGAA12020
Locations
LocationPatentsSpan
Osaka, JP12020