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Inventor

Wai Ling Chung-Maloney

Inventor
Waterbury Center, VT, US

Overview

3→
Patents
2007–2013
Patent span
Physics
Primary field (CPC G)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
8,448,118'Determining intra-die wirebond pad placement locations in integrated circuit'20137,266,789'Method and apparatus of optimizing the IO collar of a peripheral image'20077,194,707'Method and apparatus for depopulating peripheral input/output cells'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2013Patents assigned to IBM (3)· patent assignee history
2007–2013Based in Waterbury Center, VT, US· patent location history
2013Patents assigned to CHUNG-MALONEY WAI LING (1)· patent assignee history
2013Patents assigned to GRAF RICHARD S (1)· patent assignee history
2013Patents assigned to ITOH HARUO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM32007–2013
CHUNG-MALONEY WAI LINGself12013
GRAF RICHARD S12013
ITOH HARUO12013
Locations
LocationPatentsSpan
Waterbury Center, VT, US32007–2013