LexDanaLexDanabeta
Inventor

Quanbo Zou

Inventor
Weifang, CN

Overview

51→
Patents
2002–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 51 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H10HInorganic light-emitting semiconductor devices having potential barriers14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems9%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers9%
B81BMicrostructural devices or systems, e.g. micromechanical devices8%
B01LChemical or physical laboratory apparatus for general use3%
H01HElectric switches2%
C25DProcesses for the electrolytic or electrophoretic production of coatings1%
PatentTitleYear
11,093,981Smart broadcasting device202110,862,001Display device and electronics apparatus202010,854,779Micro-LED transfer method and manufacturing method202010,848,721Laser projection device and laser projection system202010,773,950MEMS microphone device and electronics apparatus202010,756,069Display device manufacturing method, display device and electronics apparatus202010,741,718Laser de-bond carrier wafer from device wafer202010,712,260Monolithic integration device and micro total analysis system comprising a micro-fluidic flow channel202010,715,923Condenser MEMS microphone and electronic apparatus202010,687,147MEMS microphone and electronic apparatus202010,616,690Capacitive MEMS microphone and electronic apparatus202010,586,886Micro-LED transfer method and manufacturing method202010,566,494Micro-LED transfer method and manufacturing method202010,433,088PCB speaker and method for micromachining speaker diaphragm on PCB substrate201910,433,042MEMS multi-module assembly, manufacturing method and electronics apparatus201910,412,491Band-pass acoustic filter and acoustic sensing apparatus201910,388,634Micro-LED transfer method, manufacturing method and display device201910,319,697Transferring method, manufacturing method, device and electronic apparatus of micro-LED201910,306,372Fully wafer-level-packaged MEMS microphone and method for manufacturing the same201910,284,986Piezoelectric speaker and method for forming the same201910,224,307Assembling method, manufacturing method, device and electronic apparatus of flip-die201910,224,308Transferring method, manufacturing method, device and electronic apparatus of micro-LED201910,212,501MEMS device with a valve mechanism201910,193,012Transferring method, manufacturing method, device and electronic apparatus of micro-LED201910,181,546Transferring method, manufacturing method, device and electronic apparatus of micro-LED201910,177,016Pre-screening method, manufacturing method, device and electronic apparatus of micro-LED201910,170,665Repairing method, manufacturing method, device and electronics apparatus of micro-LED201910,163,869Transferring method, manufacturing method, device and electronic apparatus of micro-LED201810,141,287Transferring method, manufacturing method, device and electronic apparatus of micro-LED201810,057,689Silicon speaker201810,050,180LED with stress-buffer layer under metallization layer201810,020,293Transferring method, manufacturing method, device and electronic apparatus of micro-LED201810,020,420Repairing method, manufacturing method, device and electronic apparatus of micro-LED20189,930,453'Silicon microphone with high-aspect-ratio corrugated diaphragm and a package with the same'20189,908,775'Transfer method, manufacturing method, device and electronic apparatus of MEMS'20189,866,971'Method for manufacturing thermal bimorph diaphragm and MEMS speaker with thermal bimorphs'20189,640,729'LED with stress-buffer layer under metallization layer'20179,343,612'Method of bonding a semiconductor device to a support substrate'20169,331,048'Bonded stacked wafers and methods of electroplating bonded stacked wafers'20168,970,043'Bonded stacked wafers and methods of electroplating bonded stacked wafers'20157,463,125'Microrelays and microrelay fabrication and operating methods'20087,393,758'Wafer level packaging process'20086,858,459'Method of fabricating micro-mirror switching device'20056,841,839'Microrelays and microrelay fabrication and operating methods'20056,762,049'Miniaturized multi-chamber thermal cycler for independent thermal multiplexing'20046,716,661'Process to fabricate an integrated micro-fluidic system on a single wafer'20046,621,135'Microrelays and microrelay fabrication and operating methods'20036,521,447'Miniaturized thermal cycler'20036,509,186'Miniaturized thermal cycler'20036,503,847'Room temperature wafer-to-wafer bonding by polydimethylsiloxane'20036,432,695'Miniaturized thermal cycler'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2005Patents assigned to INST OF MICROELECTRONICS (7)· patent assignee history
2002–2004Patents assigned to UNIV SINGAPORE (3)· patent assignee history
2002–2008Based in Singapore, SG· patent location history
2003–2016Patents assigned to MAXIM INTEGRATED PRODUCTS (6)· patent assignee history
2008–2016Based in Plano, TX, US· patent location history
2016–2020Based in Eindhoven, NL· patent location history
2018–2020Patents assigned to GOERTEK INC (33)· patent assignee history
2018–2020Patents assigned to LUMILEDS LLC (2)· patent assignee history
2018–2020Based in Weifang, CN· patent location history
2018–2020Based in Shandong, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GOERTEK INC332018–2020
INST OF MICROELECTRONICS72002–2005
MAXIM INTEGRATED PRODUCTS62003–2016
UNIV SINGAPORE32002–2004
LUMILEDS LLC22018–2020
Locations
LocationPatentsSpan
Weifang, CN212018–2020
Shandong, CN112018–2020
Singapore, SG102002–2008
Plano, Texas, US32008–2016
Eindhoven, NL22016–2020